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Affordable Hybrid Composites for Next Generation Gun Systems
Title: Principal Investigator
Phone: (978) 250-4200
Phone: (978) 250-4200
Triton Systems, Inc. and the University of California, Santa Barbara are developing a low-cost, hybrid composite technology which combines the high temperature corrosion resistance of ceramic matrix composite surfaces with the high strength, high thermalconductivity, machinability and weldability of a metal matrix composite. These highly integrated metal-ceramic matrix composite (MCMCÂ¿) structures can be fabricated in a range of component geometries, placing the CMC surfaces in any desired location. Forexample, MCMCÂ¿ gun barrels will be developed possessing a CMC inner bore surface which is structurally supported by a high strength MMC. These hybrid composite barrels will withstand the extreme temperatures, pressures, and chemical environments created bythe advanced gun propellants which are exceeding the capabilities of current metal gun systems. By tailoring density/composition gradients through the wall thickness, the MCMCÂ¿ will possess a functionally graded metal-ceramic interface that controlsthermal stresses and through-barrel thermal conductivity both at the micro- and macro-scales. We will develop a material properties database from which an adequate constitutive description of the material can be formulated. This work will be closelycoupled with the development of the computational design and analysis tools capable of predicting the behavior of specific MCMCÂ¿ components. Anticipated Benefits: The primary near term defense application is light weight, high performance gun tubes formedium and large bore applications. In different configurations the MCMCÂ¿ will be used for missile air frame and propulsion components. The low cost technology has direct application as high and low temperature corrosion resistance components forindustrial applications, e.g. fluid transfer pipes for the chemical industry, and wetted components in vacuum systems and waste management equipment.
* Information listed above is at the time of submission. *