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N/A

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0091570
Agency Tracking Number: 0091570
Amount: $0.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2001
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
30 Corporate Circle
Albany, NY 12203
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Kenneth Klabunde
 (518) 464-3334
 zchen@xos.com
Business Contact
 David Usher
Title: Dir. of Operations
Phone: (518) 464-3334
Email: dusher@xos.com
Research Institution
N/A
Abstract

This Small Business Innovation Research (SBIR) Phase II project will meet the demand from the microelectronics industry for an improved micro x-ray fluorescence instrument for thin film measurements. A new technique, monochromatic micro x-ray fluorescence (MMXRF) analysis using doubly curved crystal optics can meet this significant market need. A toroidal crystal can focus characteristic x-rays from a microfocus x-ray source based upon diffraction. The focused beam is monochromatic and the beam size is expected to be significantly smaller than that of current MXRF systems. This technique will provide high sensitivity and enhance excitation of low Z elements with the selection of beam energy. In addition, this technique will significantly increase the speed of high-energy x-ray measurements. A prototype MMXRF system will be developed that incorporates a modular dual beam system to probe samples with two energies simultaneously.
The initial application of the technology is in the area of semiconductor manufacturing. As semiconductor manufacturing moves to larger wafers and higher levels of integration, a single wafer may require hundreds of steps. These wafers are expensive to produce and very difficult to repair. The instrument under development would provide elemental and thickness analysis to identify defective thin film deposition at the earliest opportunity, avoiding the considerable loss associated with rejections at the end of the production line

* Information listed above is at the time of submission. *

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