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High Compliance Carbon Nanotube based Thermal Interface Material for Space Applications

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-11-M-0084
Agency Tracking Number: F103-086-1242
Amount: $99,929.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF103-086
Solicitation Number: 2010.3
Solicitation Year: 2010
Award Year: 2011
Award Start Date (Proposal Award Date): 2011-03-01
Award End Date (Contract End Date): N/A
Small Business Information
2600 Campus Drive, Suite D
Lafayette, CO -
United States
DUNS: 161234687
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 John Cronin
 Senior Engineer
 (303) 664-0394
Business Contact
 Lori Bass
Title: Sr. Finance and Contracts Manager
Phone: (303) 664-0394
Research Institution

ABSTRACT: The U.S. Air Force is seeking high-thermal conductivity gaskets to improve the thermal efficiency of space-based electronic systems. Advanced gasket materials will enhance the performance of electronic packages by improving heat dissipation during operation. Moreover, thermal management systems are often large, relatively heavy components that add volume and weight to the spacecraft. To address the need for improved thermal interface materials (TIM), Carbon Nanotube (CNT) Array-based TIM"s will be developed. These materials will be lightweight, highly compliant, reworkable, and highly thermally conductive. In addition, the CNT-based TIM"s will significantly reduce assembly, integration, and test time (AI & T) for the spacecraft. BENEFIT: With increased thermal capacity, as well as lighter weight and smaller packaging, thermal gaskets with carbon nanotube array could revolutionize the thermal management systems used in microprocessors, telecommunication systems, and power supplies. Heat dissipation is often a limiting factor in the performance of these systems, and the use of interface materials with significantly higher thermal conductivities will enable the construction of smaller and lighter systems, while also reducing power consumption. The results will be improved operational performance and longer lifetimes in the electronic components.

* Information listed above is at the time of submission. *

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