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Transient Electromagnetic Simulator for EMP Survivability Analysis of Packaged Electronic Systems

Description:

OBJECTIVE: Provide transient simulation capabilities of high-power electromagnetic interference for signal/power distribution networks of packaged electronics. DESCRIPTION: Implementing the computer-aided design (CAD) tools for modeling of high-power electromagnetic interference (HPEMI) effects, caused by electromagnetic pulses/high-altitude electromagnetic pulses (EMPs/HEMPs), at the platform (airplane) level is hindered by both the complexity of modeling the electromagnetic coupling paths through a physical structure of the platform and the complexity of integrated circuit (IC) chipsets that house the packaged electronic blocks (digital, analog, radio-frequency), whose functionality degrades significantly as a result of HPEMI. While significant progress has been made in modeling the complexity of the electromagnetic coupling path [1-3], very little progress has been made in the development of systematic modeling methodologies that address the complexity of IC chipsets and their connecting traces/cables that house the power distribution network of packaged electronic blocks. Since the power distribution network serves as the primary conduit for HPEMI effects found typically in many printed circuit boards (PCBs), the inclusion of the electromagnetic (EM) modeling that treats the details of the interactions between IC chipsets and connecting traces/cables in the packaged electronic blocks becomes a critical issue in the development of a reliable and accurate HPEMI analysis tool. Specifically, this project looks for a CAD based tool needed for determination of the geometry-dependent, parasitic impedances, such as per unit length (PUL) inductance matrix L, PUL capacitance matrix C and PUL resistance matrix G, which are essential input parameters used in transient multi-conductor transmission line (MTL) simulators, that reflect on details of the coupling interactions for IC chipsets and connecting traces/cables in packaged electronic blocks in the frequency range that spans from 100 MHz to 10 GHz. It is important that the developed CAD tool is capable of designing and creating the layout of complex IC chipset and connecting trace/cable structures, represented as shielded inhomogeneous dielectric and conductive media, since the layout itself contains the necessary material and cross-section area information that one needs to solve the static 2 D Laplace equation for geometry-dependent, parasitic impedances. The static 2 D Laplace equation needs to be solved, as part of the CAD based tool, for electric field potentials using either the finite difference or finite element technique in order to handle any shaped geometries of connecting traces/cables. The calculated potentials are, in turn, used to solve for per unit length (PUL) inductance matrix L, PUL capacitance matrix C and PUL resistance matrix G using the generalized MTL inductance matrix formulation, the generalized MTL capacitance matrix formulation and the generalized MTL resistance matrix formulation, respectively. In addition, the developed CAD based tool needs to be incorporated within a transient MTL simulator as part of the overall CAD based simulation tool to provide seamless interfaces with traditional circuit analysis simulators, such as Simulation Program with Integrated Circuit Emphasis (SPICE) [4], and transient EM field simulators, for carrying out the HPEMI effects analysis on packaged electronic blocks, such as PCBs, as a result of the E1 (early-time) component of the HEMP waveform that lasts about 100 nanoseconds in duration at peak electric field levels of about 50 kilovolts/meter. PHASE I: Develop a methodology for a transient MTL simulator that can handle the complexity of the power distribution network in packaged, integrated circuit chipsets with the requirement that the transient MTL simulator has seamless interfaces with industry standard SPICE circuit analysis simulators and transient electromagnetic field simulators. PHASE II: Based on the methodology developed in Phase I, develop and demonstrate a CAD based tool for the calculation of parasitic impedances, used as inputs to a transient MTL simulator, that are applicable for HPEMI effects analysis of packaged electronic blocks in the HEMP environment. Also, develop and demonstrate a CAD based transient MTL simulator to interface seamlessly with industry standard SPICE circuit analysis simulators and transient EM field simulators. PHASE III: Combine the transient EM simulator with the system-level, HPEM effects codes, such as JREM [5], to perform comprehensive system-level analysis of HPEMI for supporting the overall system designs of noise-immune, packaged electronics for military and industrial communication applications. REFERENCES: 1. C. E. Baum,"Electromagnetic Topology for the Analysis and Design of Complex Electromagnetic Systems,"Fast Electrical and Optical Measurements, Vol. I, Eds., I. E. Thompson and L. H. Luessen, Martinus Nijhoff, Dordrecht, 1986. 2. F. M. Tesche and C. M. Butler,"On the Addition of EM Field Propagation and Coupling Effects in the BLT Equation,"Interaction Notes (EMP-3), Note 588, December 13, 2003. (Go to http://www.ece.unm.edu/summa/notes/ to find the above paper) 3. H. Bagci, A. E. Yilmaz, J-M. Jin and E. Michielssen,"Fast and Rigorous Analysis of EMC/EMI Phenomena on Electrically Large and Complex Cable-Loaded Structures,"IEEE Trans. on Electromagnetic Compatibility, Vol. 49, No. 2, pp. 361-381, 2007. 4. A. Vladimirescu, The SPICE Book. 1994, New York; Wiley. Transient simulation, electromagnetic modeling, electromagnetic interference, electromagnetic pulse, EMP, HEMP, electronic package simulation 5. W. Clover, et al.,"Radio Frequency Propagation and Target Effects Code (RF-PROTEC) User"s Manual (Version 4.0) Including The Joint Radio Frequency Effects Model (JREM) (Version 1.0.4),"AFRL RD PS 2011 0028, 30 September 2010.
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