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Conformable Thermal Ground Plane

Award Information
Agency: Department of Defense
Branch: Defense Threat Reduction Agency
Contract: HDTRA1-13-P-0008
Agency Tracking Number: T122-002-0142
Amount: $149,897.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: DTRA122-002
Solicitation Number: 2012.2
Solicitation Year: 2012
Award Year: 2013
Award Start Date (Proposal Award Date): 2013-03-13
Award End Date (Contract End Date): 2013-10-12
Small Business Information
686 S. Taylor Ave., Suite 108
Louisville, CO -
United States
DUNS: 968561584
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Seth Miller
 (972) 814-3813
Business Contact
 Douglas Campbell
Title: President&CEO
Phone: (720) 300-8167
Research Institution

Miniaturized smart munitions are seeing increasing use across all branches of the Department of Defense (DoD) in order to meet the ever evolving mission needs for the U.S. warfighter. These smart micromuntions have been enabled by advances in capabilities and miniaturization of critical microelectonic and microelectromechanical systems such as sensor, navigational, communications, and triggering subsystems. Their small size and stringent packaging requirements in an often complex and crowded munitions platform leaves little space for active cooling for required levels of thermal management. As a result, the DoD has considerable interest in the development of advanced thermal management technologies and materials that can better accommodate the thermal budget of existing munitions platforms without the need to redesign the systems. The development of such a technology will provide needed heat transfer margins for electronic devices, reduce the size and mass of the thermal management system and increase munition payload capacity thereby increasing overall system performance and effectiveness. To address this need, i2C Solutions proposes the development of a highly novel thermal ground plane technology that provides considerable thermal conductivity, EMI protection and in a highly ruggedized package.

* Information listed above is at the time of submission. *

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