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Reconfigurable Optical Elements Based on Single and Coupled Microdisk Resonators with Quantum Dot Active Media

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-10-C-0055
Agency Tracking Number: F08A-024-0293
Amount: $500,000.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: AF08-T024
Solicitation Number: 2008.A
Timeline
Solicitation Year: 2008
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-03-08
Award End Date (Contract End Date): 2012-03-08
Small Business Information
104 Addison Lane
Greenvale, NY 11548-
United States
DUNS: 623622292
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Vinod Menon
 CTO
 (609) 575-1752
 menon@hybridphotonics.com
Business Contact
 Irena Tsarevsky
Title: President
Phone: (609) 575-1752
Email: tsarevsky@hybridphotonics.com
Research Institution
 Queens College of CUNY
 Igor Kuskovsky
 
Department of Physics 65-30 Kissena Blvd.
Flushing, NY 11367-
United States

 (718) 997-3367
 Nonprofit College or University
Abstract

In this Small Business Technology Transfer Program (STTR) - Phase II project we will build photonic integrated circuits that perform flip-flop and optical switching operations on silicon platform. These circuits are based on our Phase I work where we have established the feasibility of using coupled microdisk resonators and active waveguides coupled to a single microring resonator to realize bistable operation. The active structures consist of colloidal quantum dots embedded in a polymer host. Specifically, we will develop two archetype photonic circuits: an integrated optical flip-flop and a Mach-Zehnder all-optical switch integrated with an optical flip-flop. The latter will be used to demonstrate the multi-functionality of the circuit and will be tested for data routing application. The proposed devices will be designed, fabricated and characterized as part of this program and the fabrication processes, and devices designs will be optimized to allow large scale manufacture while maintaining reproducibility and repeatability. Processes parameters will be designed to meet the requirements of standard CMOS foundry there by enabling large scale photonic circuits to be realized at low cost and high volume. We also discuss our commercialization plan, target dates for achieving different technology readiness levels and transition plan to Phase III. BENEFIT: The proposed photonic integrated circuits will be realized on Silicon platform allowing easy integration with electronics and the use of silicon foundries for large scale manufacture. Furthermore, the Silicon on insulator platform allows realization of devices with small footprint and the use of colloidal quantum dots provides wavelength versatility and large optical nonlinear effects while keeping the overal cost low. The proposed circuits that will be realized as part of the phase II program can be used for ultrafast all-optical signal processing and data routing applications that meet both commercial and military needs of the future.

* Information listed above is at the time of submission. *

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