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Nanotechnology and Molecular Interconnects

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-10-C-0064
Agency Tracking Number: F09B-T35-0207
Amount: $99,975.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: AF09-BT35
Solicitation Number: 2009.B
Solicitation Year: 2009
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-04-01
Award End Date (Contract End Date): 2010-12-31
Small Business Information
27130A Paseo Espada, Suite 1405
San Juan Capistrano, CA 92675
United States
DUNS: 829136030
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mark Bennahmias
 Senior Scientist
 (949) 340-7209
Business Contact
 Michael Zani
Title: President & CEO
Phone: (949) 422-6625
Research Institution
 Sandia National Labs
 Stephen Howell
PO Box 5800
Albuquerque, NM 87185-
United States

 (505) 284-1457
 Federally Funded R&D Center (FFRDC)

Graphene has become one of the most promising new materials to form semiconductor devices and microelectronic interconnects. NexGenSemi Corporation in collaboration with Sandia National Labs will develop a “Patterned Graphene Interconnect (PGI) and material modification for nanofabrication of transistor devices. This process resolution will dip deep down into the state-of-the-art technology nodes, leveraging some of the mobility, bandgap, and nanoscale structure advantages of the material. During this program, SNL will focus on the supply and process mechanics of high quality graphene films and NGSC will focus on the physical process associated with PGI, both leading to hybrid and graphene based microelectronics. Special emphisys will be placed on developing a reliable/repeatable and low cost process model for future commercialization into VLSI applications. BENEFIT: The program would benefit the DOD and Commercial electronics by providing high frequency, highly integrated, low power electronics, leading to high speed digital signal processing in focal plane arrays and on board computing.

* Information listed above is at the time of submission. *

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