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Guidance System on a Chip


Small munitions and individual warfighter launchable unmanned systems place a premium on the volume and weight available to both primary and payload systems. For precision weapons, the current state of the art in guidance systems was developed for larger diameter systems (81mm and above) and are simply too large and consume too much power to meet the needs of future precision weapon roadmaps (targeting 60mm and below). An innovative solution that combines all of the required processing, memory, inertial sensing, and multi-interface capabilities into a single microchip device will enable precision weapons as small as 30 to 40mm in diameter to be realized. For unmanned systems this will help to fully maximize the available payload volume. For both manned and unmanned systems it will decrease power system requirements. The guidance system will reduce cost and supply chain issues through part count reduction and commonality across procurements. Reductions in size, weight, and power of the guidance system will also benefit larger caliber systems. The risk lies in the combining of electronic with different substrates and manufacturing processes. The new guidance system will need to be a printed circuit board (PCB) mountable, self-contained device, no larger than 13mm (L) x 13mm (W). Internal packaging can be single or multiple die, as long as the whole device when properly secured to the PCB can be hardened to survive 50,000g acceleration loads. The embedded inertial sensors should include, at a minimum, 3-axis rate sensor and 3-axis accelerometer, with desire for 3-axis magnetometer. The I/O connections need to include 4 channel motor control (including actuator feedback), external analog sensor inputs, external digital sensor inputs, high speed serial for diagnostic/telemetry data, fuze communications, and re-programming interface. PHASE I: Define and develop a concept for a Guidance System on a Chip that can meet the requirements listed in the description. Identify concepts and methods for integrating the required components and capabilities, possibly from different substrates and manufacturing techniques, onto a single chip die, or integrated multi-die package. PHASE II: Complete detailed design and layout of the chip solutions defined in Phase I. Conduct modeling and simulation of the chip designs to reduce fabrication error risk and validate shock survivability of selected packaging solution. Phase II includes first fabrication run of chip(s), with a possible Phase II option concluding with testing the fully packaged device. PHASE III: Integrate the prototype microchip device design from Phase II into the current USMC Guided Projectile (Mortar, Artillery, Rocket, Shoulder Launched), ONR 30 Guided Projectile S&T, and/or the Hyper Velocity Projectile (HVP) projectile. It will be tested in shock environment, Hardware-in-the-Loop, and live fire testing.
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