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High Resolution Three-Dimensional Digital Reconstruction of Integrated Circuits

Award Information
Agency: Department of Defense
Branch: Defense Microelectronics Activity
Contract: HQ0727-14-P-1410
Agency Tracking Number: 14-4B2
Amount: $149,932.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: DMEA132-002
Solicitation Number: 2014.2
Timeline
Solicitation Year: 2014
Award Year: 2014
Award Start Date (Proposal Award Date): 2014-03-13
Award End Date (Contract End Date): 2014-09-12
Small Business Information
15201 NW Greenbrier Pkway Ste C6
Beaverton, OR 97006
United States
DUNS: 022570582
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Wayne Ford
 VP Research and Development
 (503) 608-7237
 wayne@jht-instruments.com
Business Contact
 Brandon Smith
Title: Electronics Engineer
Phone: (916) 231-1617
Email: brandon.smith@dmea.osd.mil
Research Institution
N/A
Abstract

Facile reverse engineering of existing devices by means of 3D reconstruction is an emergent need for advanced semiconductor technologists who seek to understand product failures, to improve device design and manufacturability, and to verify as-built device compliance to specified designs. The latter objective relates particularly to trusted and counterfeit device programs. Today's barriers to practical 3D reconstruction include throughput, reliability, fidelity and data volume. Our Phase I proposal will: a) Determine best methods to be utilized for development of a tool for 3D digital reconstruction of integrated circuits that meets DMEA constraints for this SBIR topic. b) Prepare a development plan for a proof-of-concept tool including performance specifications, budget and Gantt chart. c) Include a commercialization roadmap for this tool, and d) Deliver these items as a report to the DMEA at the end of Phase I.

* Information listed above is at the time of submission. *

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