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Ruggedized Ceramic Circuit Card Assemblies

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-15-C-7226
Agency Tracking Number: B2-2052
Amount: $999,981.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: MDA13-005
Solicitation Number: 2013.2
Timeline
Solicitation Year: 2013
Award Year: 2015
Award Start Date (Proposal Award Date): 2015-06-11
Award End Date (Contract End Date): 2017-06-10
Small Business Information
10 Manor Parkway, Ste. C
Salem, NH 03079
United States
DUNS: 026965590
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: Yes
Principal Investigator
 Matthew Erdtmann
 Vice President of Technology
 (603) 893-7600
 me@micropt.com
Business Contact
 Sabina Chen
Title: PMO
Phone: (603) 893-7600
Email: sc@micropt.com
Research Institution
N/A
Abstract

Micro-Precision Technologies (MPT) will build, test, and deliver to military high-performance ceramic circuit card assemblies for the Throttling Divert and Attitude Control System (TDACS). Based on our commercially proven technology for ceramic-based hybrid microcircuit and multi-chip module manufacturing, we will meet the MDA requirements for increased solder toughness, reduced footprint and weight, and survivability to temperature and humidity cycling, vibration, and shock. Approved for Public Release 15-MDA-8169 (20 March 15)

* Information listed above is at the time of submission. *

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