Description:
Micro-electronics Packaging, Thermal Management & Systems Integration (MT)
Proposals are solicited on more efficient means of integrating semiconductor components and devices into systems. The growth in chip density, coupled with the demand for high performance, small size, light weight, and affordable reliability has placed enormous pressure on interconnect technology and packaging at all levels. Innovations include (but not limited to) improved techniques for interconnect and packaging at the board level, packaging approaches for the board components, the passive components, techniques for board assembly, and applications of techniques to packaging and systems integration for optoelectronics and wireless systems.
