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American Semiconductor, Inc.

Company Information
Address 6987 W Targee St
Boise, ID, 83709-3209


DUNS: 076338677

# of Employees: 13

Ownership Information

HUBZone Owned: N

Socially and Economically Disadvantaged: N

Woman Owned: N

Award Charts

Award Listing

  1. Enabling Flexible Materials, Devices and Processes for Defense

    Amount: $1,349,974.00

    ABSTRACT:Emergence and feasibility for flexible body-worn electronics and particularly medical patches requires high performance electronics capability.The problem is that these new technologies must ...

    SBIRPhase II2014Department of Defense Air Force
  2. FleX-3D Wafer Processing for Chip Stacking and Interconnect

    Amount: $149,977.00

    Reliable, readily-manufacturable technologies are needed to create the next generation of high-density, high-functionality 3D integrated circuits (ICs) for integrating silicon pixel detectors with CMO ...

    SBIRPhase I2013Department of Energy
  3. A 45 nm Low Cost, Radiation Hardened, Platform Based Structured ASIC

    Amount: $124,926.00

    The proposed 45 nm radiation hardened platform based structured ASIC architecture offers the performance and density expected of a custom ASIC with the low manufacturing cost associated with a structu ...

    SBIRPhase I2012National Aeronautics and Space Administration
  4. Conformal Load Bearing Antenna Structure

    Amount: $149,990.00

    ABSTRACT: American Semiconductor will develop and demonstrate structural integration of a conformal load bearing antenna structure (CLAS). Future aircraft will incorporate distributed electronics, s ...

    SBIRPhase I2012Department of Defense Air Force
  5. Ultra Low Power, Radiation Hardened, Reconfigurable Analog-to-Digital Converter

    Amount: $99,963.00

    The goal of this project is to develop an ultra low power (ULP), radiation hardened, reconfigurable analog-to-digital converter (ADC) in the 130nm Flexfet Independently Double Gated SOI CMOS process. ...

    SBIRPhase I2011Department of Defense Missile Defense Agency
  6. High Performance, Ultra Low Power SPA-1 ASIC for Space Plug-and-Play Avionics

    Amount: $749,365.00

    ABSTRACT: The Space Plug-and-play Avionics (SPA) initiative is designed to improve the ability of the US military to respond to rapidly changing operational needs by creating, integrating, and launch ...

    SBIRPhase II2011Department of Defense Air Force
  7. Next-Generation Detector and Imager Development

    Amount: $999,954.00

    Existing silicon on insulator (SOI) pixel detectors which integrate single gate transistors with substrate diodes are limited by two key problems. First, the SOI transistor performance is degraded by ...

    SBIRPhase II2011Department of Energy
  8. Ultra Low Power, High Performance Microprocessor Core for Military and Space Applications

    Amount: $99,869.00

    For Phase I, an ultra low power, high performance microprocessor core using a combination of double-gated and independent double-gated Flexfet™ SOI CMOS technology from American Semiconductor will b ...

    SBIRPhase I2010Department of Defense Air Force
  9. Next-Generation Detector and Imager Development

    Amount: $99,971.00

    Improvements in silicon-on-insulator (SOI) technology have resulted in development of monolithic chip designs for radiation image sensors and particle detectors by facilitating the use of the handle s ...

    SBIRPhase I2010Department of Energy
  10. Direct Write via Digital Beam Processing for Rad-Hard Flexfet CMOS

    Amount: $99,917.00

    The is an effort to increase radiation hardness/survivability of microelectronics through innovation of production processes and capabilities by establishing an economically viable low-volume sub-65nm ...

    SBIRPhase I2009Department of Defense Missile Defense Agency
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