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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Highly-Integrated SiC BiCMOS/Power Device Technology: Design, Modeling, and Reliability Metrics

    SBC: COOLCAD ELECTRONICS, LLC            Topic: DMEA211001

    We propose to lay the groundwork for the implementation of a completely integrated SiC BiCMOS/LDMOS technology for integrated control/power circuit applications reliable for operation up to 300 C. Our workplan to accomplish this goal comprises improving device speed and reliability by device engineering, establishing baseline reliability and qualification tests to support and certify development, ...

    SBIR Phase I 2021 Department of DefenseDefense Microelectronics Activity
  2. DATUM: Determining Authenticity and Trustworthiness of Microelectronics Parts

    SBC: Intelligent Automation, Inc.            Topic: DMEA192002

    The aging supply chain management is the available long term protection against IC counterfeiting. For better protection, there is an urgent need for an advanced counterfeit detection system. The industry has made progress in cataloging the features in counterfeit parts and the physical tools to detect them. However, the methods still largely depend on human skills which are time consuming and oft ...

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  3. BlockChain Enhancement for Trusted FPGAs & ASICs

    SBC: Intelligent Automation, Inc.            Topic: DMEA182003

    ASIC and FPGA design and manufacturing companies are globally distributed. As a result, third party IP designs sent to offshore to untrusted fabs for manufacture are vulnerable to security threats such as cloning, over-building and reverse engineering. There is a growing need to enhance the security of the ASIC and FPGA supply chain. The blockchain technology which is primarily used in cryptocurr ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
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