The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until September, 2020.
The Characterization and Mitigation of Single Event Effects in Ultra-Deep Submicron (< 90nm) MicroelectronicsSBC: Orora Design Technologies, Inc. Topic: DTRA07005
Orora Design Technologies proposes to develop electronic design automation (EDA) tools employing minimally invasive circuit design-based methods to mitigate single event effects (SEEs) for next generation Ultra-DSM CMOS (SBIR Phase II 2008 Department of DefenseDefense Threat Reduction Agency
SBC: Terra Tek Inc. Topic: N/A
QUANTITATIVE VERIFICATION OF THE RESIDUAL IN-SITU STRESS FIELD WHICH CREATES THE CONTAINMENT CAGE IS NEEDED TO ASSESS THE FACTOR OF SAFETY AGAINST HYDRAULIC FRACTURING FROM THE CAVITY WALL. PHASE I WILL ESTABLISH THE FEASIBLITY OF DEVELOPING A PASSIVE STRESS GAUGE, ABSENT OF ACTIVE INSTRUMENTATION, AND CAPABLE OF RECORDING THE RESIDUAL IN-SITU STRESS FIELD IMMEDIATELY FOLLOWING THE NUCLEAR DEVICE ...SBIR Phase II 1991 Department of DefenseDefense Threat Reduction Agency