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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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Advanced Manufacturing Technologies
SBC: SENTIENT SCIENCE CORPORATION Topic: DLA152001In response to DLA SBIR Topic DLA152-001 for Advanced Manufacturing Technologies, Sentient Corporation (Sentient) proposes to develop a life cycle cost optimization tool based on our commercial DigitalClone modeling technology. This tool will enable users to evaluate the tradeoffs between alternate manufacturing processes, implementation costs, and the performance/durability of the resultant comp ...
SBIR Phase II 2017 Department of DefenseDefense Logistics Agency -
Secure Protocol Unalterable Data (SPUD) Phase II
SBC: IDAHO SCIENTIFIC LLC Topic: MDA15009Idaho Scientific proposes the development of Secure Protocol Unalterable Data (SPUD) as a means to identify activity against system technologies. Approved for Public Release | 17-MDA-9219 (31 May 17)
SBIR Phase II 2017 Department of DefenseMissile Defense Agency -
Reliability Centered Additive Manufacturing Design Framework
SBC: SENTIENT SCIENCE CORPORATION Topic: N152109Sentient along with sub-contractors at Iowa State University, and Honeywell Aerospace will develop and validate the full standalone DigitalClone - Component (DCC) simulation package (the proposed Reliability Centered Additive Manufacturing Design Framework), for assessing tradeoffs in reliability, inspectability, performance/durability and life-cycle costs of parts made through Additive Manufactur ...
SBIR Phase II 2017 Department of DefenseNavy -
Development of In-Process Monitoring Closed-Loop Feedback for Use in Aluminum Alloy Additive Manufacturing (AM) Applications
SBC: SENTIENT SCIENCE CORPORATION Topic: A17003Sentient Corporation proposes to integrate its DigitalClone® Component (DCC) physics-based modeling technology and John’s Hopkins University Applied Physics Laboratory’s in-situ thermal sensors to develop a comprehensive sensor-based tool to monitor, identify and locate defects in metallic additive manufacturing, and create a DCC model-enabled feedback loop to correct the process-induced defe ...
SBIR Phase I 2017 Department of DefenseArmy
