You are here

Award Data

For best search results, use the search terms first and then apply the filters
Reset

The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Sputter Synthesis of Bulk Aluminum Nitride

    SBC: Carolina Sputter Solutions            Topic: N/A

    The proposed research will demonstrate the feasibility of using a novel physical vapor deposition (PVD) technique for bulk growth of aluminum nitride(AlN). We have developed a sputter source which demonstrates the high growth rates needed for growing bulk aluminum nitride. In comparison with other bulk growth processes this novel PVD process has the advantages of a controlled processing environmen ...

    STTR Phase I 1998 Department of DefenseMissile Defense Agency
  2. Development of a Truly Lattice-Matched III-Nitride Technology for

    SBC: CERMET, INC.            Topic: N/A

    Cermet, in collaboration with researchers at Georgia Institute of Technology, proposes to implement a lattice matched III-Nitride technology using existing substrates. The implementation of a lattice matched substrate promises to produce near dislocationfree III-Nitrides for the first time while the use of an existing substrate technology dramatically lowers development cost and reduces the devel ...

    STTR Phase I 2001 Department of DefenseMissile Defense Agency
  3. Growth of AlN Crystals

    SBC: HEXATECH            Topic: N/A

    The objective of this proposal is to demonstrate the feasibility of growing centimeter-size aluminum nitride (AlN) crystals by subliming polycrystalline AlN in nitrogen atmosphere, and to demonstrate single crystalline quality meeting or exceeding thestandards of commercially available SiC wafers. The growth process, which utilizes high temperature, subatmospheric pressure and a steep temperature ...

    STTR Phase I 2001 Department of DefenseMissile Defense Agency
  4. High Power Gallium Nitride HEMT Prepared by Ion Implantatio

    SBC: Implant Sciences Corporation            Topic: N/A

    Implant Sciences Corporation proposes to develop a superior power transistor design based on ion implanted nitride semiconductor materials which will be produced at Howard University. Our lateral device design features an inverted GaN channel with the AlGaN charge supply layer doped by ion implantation. Ion implantation allows selective area doping, which will let us create for the first time an u ...

    STTR Phase I 1998 Department of DefenseMissile Defense Agency
  5. Tooling-Free MMC Casting by Combining 3-D Printing of Ceram

    SBC: METAL MATRIX CAST COMPOSITES, LLC (DBA M            Topic: N/A

    Three-dimensional printed preforms will be used as mold patterns for MMCC's high-density, pressure resistant, castable refractory. Hard tooling will be eliminated from the Advanced Pressure Infiltration Casting process (APIC ). Cost for Al/Sic electronic housings will be slashed 75% over conventional pressure casting. Complex parts will be easily manufactured. Design modifications can be quickly i ...

    STTR Phase I 1998 Department of DefenseMissile Defense Agency
  6. Quantum Dot/Silicon MixedIC Sensor Technology

    SBC: Nanolume, Inc.            Topic: N/A

    Chemically synthesized quantum dots with an emphasis on Gallium Nitride are used in conjunction with polymeric dielectrics to make thin film materials for coated layers on bulk semiconductor substrates such as Silicon wafers. The layers supply high performance radiation sensing crystalline semiconductor materials to the surface of standard Silicon ICs. Multiple bands may be sensed by mixing and ma ...

    STTR Phase I 1998 Department of DefenseMissile Defense Agency
  7. Growth of New Wide Band Gap Nitride Semiconductors for Yell

    SBC: NZ APPLIED TECHNOLOGIES CORP.            Topic: N/A

    The goal of the SBIR Phase I proposal is an attempt to grow the world's first single crystalline new wide band gap nitride semiconductors by MOCVD for developing optoelectronic and optical devices in yellow to green visible band as well as lattice matched heterostructure wide band gap electronic devices. The expected direct transition, wide band gap electronic structure and the significant nonline ...

    STTR Phase I 1998 Department of DefenseMissile Defense Agency
  8. Improved SiC Materials for High Power Electronics

    SBC: PHOENIX INNOVATION, INC.            Topic: N/A

    Silicon has long been the semiconductor of choice for high-voltage power electronic applications. Recently, SiC has attracted attention because SiC is projected to have better performance than silicon. [1] SiC power switching devices have yet to becommercialized, largely due to SiC crystal defects, most notably the device-killing micropipe defect, which does not permit high total current parts t ...

    STTR Phase I 2001 Department of DefenseMissile Defense Agency
  9. A Tunable Interferometric Random Optical Cross-Switch

    SBC: Scientific Solutions, Inc.            Topic: N/A

    A random access, solid-state, optical cross-switch capable of 770 channel discrimination in the telecommunications C-band is designed and proven as an alternative to current thin-film WDM devices and as a mechanically robust alternative tomicroelectromechanical (MEMS) WDM devices. The device may be used in multiplexing (mux), demultiplexing (demux), or complete cross-switch configurations, and is ...

    STTR Phase I 2001 Department of DefenseMissile Defense Agency
  10. Novel heterojunction diodes for High Power Electronics

    SBC: PHOTRONIX            Topic: N/A

    The wide-bandgap semiconductors GaN and SiC hold great promise for high temperature and highpower electronic devices. This is due to the attractive properties these materials possess, such as wide energy bandgaps, high breakdown fields, high thermalconductivities, and high saturated electron velocities. In addition, GaN and SiC have adequate electron mobilities and can readily be doped n and p ty ...

    STTR Phase I 2001 Department of DefenseMissile Defense Agency
US Flag An Official Website of the United States Government