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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Radio Frequency Infrared (RF-IR) Data Fusion

    SBC: DECIBEL RESEARCH, INC.            Topic: MDA12T002

    Under the Phase I effort, a set of algorithms were developed/enhanced that, when integrated into a fused track and characterization schema, are capable of realizing the full potential performance afforded by the battle manager having multiple sensors. dBWager is a multi-sensor measurement correlation algorithm that provides highly accurate state vector estimates and provides the correlation of e ...

    STTR Phase II 2014 Department of DefenseMissile Defense Agency
  2. Enhancement of Ballistic Missile Defense System Level Simulation Operations Through Multi-core Processing

    SBC: ISSAC Corp            Topic: MDA13T003

    The ISSAC Team propose a novel method to encapsulate legacy models and simulations that allows these components to take advantage of modern, multi-core, multi-processor hardware suites. Encapsulating these legacy codes provides 3 primary advantages to deal with complex systems and systems of systems (Air Force, Navy, Department of Homeland Security (DHS), Federal Emergency Management Agency (FEMA) ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  3. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD RESEARCH CORPORATION            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
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