Award Data

GaN-based devices are the basis of a variety of modern electronics applications, especially in optoelectronics and high-frequency / high-power electronics. These devices are based on epitaxial films grown on single-crystal wafers. The single-crystal wafer substrates are limiting because of their size, expense, mechanical properties and availability. If one could make GaN-based devices over large a ...

The ISSAC Team propose a novel method to encapsulate legacy models and simulations that allows these components to take advantage of modern, multi-core, multi-processor hardware suites. Encapsulating these legacy codes provides 3 primary advantages to deal with complex systems and systems of systems (Air Force, Navy, Department of Homeland Security (DHS), Federal Emergency Management Agency (FEMA) ...

Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

Automatic speech recognition (ASR) technology is in wide use today and has been successfully integrated into a number of applications. Although there are also many potential applications for automatic speaker identification (SID), SID accuracy rates are generally not sufficient for widespread use in practical applications. For high accuracy ASR and SID, the microphone must be located near the talk ...

EO/IR sensors can provide high spatial resolution images using multiple frequency bands ranging from the visible to mid-wave IR. EO/IR sensors have been very successful for terrain imaging from subsonic aircraft and from satellites. Imaging using these platforms has been studied extensively. EO/IR sensors can provide high spatial resolution images using multiple frequency bands ranging from the v ...

The overall project objective is to develop and demonstrate a software package based on Fermi kinetics charge transport and Delaunay/Voronoi field discretization that accurately predicts semiconductor device behavior from DC up through the mm-wave and TH...

Our Phase I work focused on improving modeling and simulations so that the impact of autonomous systems in the battlespace could be better understood. As we have trained our attention on Phase II, it has become increasingly clear that the work we are doing to improve the modeling and simulation of autonomous systems also provides significant leverage for the development of the intelligent behavior ...

The objective of the overall STTR program is to develop a high performance mid-format dual band long wave infrared (IR) focal plane array (FPA) using p-type InAs/(In)GaSb strained layer superlattices (SLS). The project consists of three primary research thrusts including (1) improvement of quantum efficiency, (2) optimized sidewall passivation, and (3) focal plane array fabrication and testing. ...

The objective of this program is to build AHaH Computing demonstration chips and boards, establishing in the process the technical frameworks for a memristor wafer services business with the Idaho Microfabrication Laboratory (IML) at Boise State University (BSU), Dr. Kris Campbell at BSU, and other fabrication facilities. We believe that AHaH Computing and kT-RAM offer the most practical and robus ...

The SEAKR team proposes to continue development of the advanced protocol routing system begun in the Phase I effort, to reduce risk toward a flight deployable system for SATCOM assets such as Iridium NEXT. SEAKRs development of the Iridium NEXT modem...