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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD RESEARCH CORPORATION            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  2. Infectious Disease Diagnostics and Differentiation of Viral vs. Bacterial Infections for Point of Care Applications

    SBC: GENECAPTURE, INC.            Topic: CBD15C001

    The modern warfighter faces the constant threat of endemic infections, multi-drug resistant bacteria and Biological Warfare Agents. In order to provide accurate front-line treatment that will curtail the overuse of antibiotics, a rapid and robust molecula

    STTR Phase I 2016 Department of DefenseOffice for Chemical and Biological Defense
  3. System of Systems Control Interactions

    SBC: Torch Technologies, Inc.            Topic: MDA15T002

    Control Theory tools and processes for analyzing the interactions of complex System of Systems (SoS) are lacking, specifically when sub-systems are independently designed and/or higher levels of SoS controls are applied. Integrating these sub-systems into the SoS, can result in dynamic interactions between these sub-systems and the SoS controls resulting in unexpectedly large deviations between ex ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  4. Sufficient Statistics for System of Systems Control (S4C)

    SBC: Intelligent Automation, Inc.            Topic: MDA15T002

    There is an urgent need to develop and demonstrate innovative control, design and analysis techniques to characterize the stability and performance of a system of systems (SoS) as a function of sub-system dynamics, network structure and control/decision processes. This is particularly true in the missile defense scenario, which involves a coordinated defense against threats. However, there is no e ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  5. System of Systems Control Interactions

    SBC: GTD Unlimited LLC            Topic: MDA15T002

    In this research effort, GTD Unlimited will design tools for efficiently specifying, representing, and analyzing the interactions between control systems in System of Systems (SoS). Our approach will be to model the problem as an uncertain system and analyze the resulting models using control methods. Control methods can be related back to the standard Nyquist criterion for stability, ensuring t ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  6. Mechanistic Model Development for Gold Contaminated Solder Joint Reliability

    SBC: DFR SOLUTIONS, LLC            Topic: MDA15T005

    DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contaminatio ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  7. CCA-SAFE: A Model-Assisted NDE Tool for Failure Analysis of Gold Contaminated Solder Joints

    SBC: Intelligent Automation, Inc.            Topic: MDA15T005

    Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  8. Gold-Contaminated Solder-Joint Characterization for Quantifying Risk Associated with Gold Embrittlement

    SBC: Enig Associates, Inc.            Topic: MDA15T005

    Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  9. Enhancement of Ballistic Missile Defense System Level Simulation Operations Through Multi-core Processing

    SBC: ISSAC Corp            Topic: MDA13T003

    The ISSAC Team propose a novel method to encapsulate legacy models and simulations that allows these components to take advantage of modern, multi-core, multi-processor hardware suites. Encapsulating these legacy codes provides 3 primary advantages to deal with complex systems and systems of systems (Air Force, Navy, Department of Homeland Security (DHS), Federal Emergency Management Agency (FEMA) ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  10. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD RESEARCH CORPORATION            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
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