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The Award database is continually updated throughout the year. As a result, data for FY20 is not expected to be complete until September, 2021.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD Research Corporation            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  2. Base Metal Electrode Capacitor Test Methods

    SBC: FUNDO SCIENCE CORPORATION            Topic: MDA14T003

    Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  3. Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and Design

    SBC: Space Micro Inc.            Topic: MDA14T002

    Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  4. Micro-Particle Debris Characterization from Hyper-Velocity Impacts

    SBC: Torch Technologies, Inc.            Topic: MDA13T002

    Leveraging the results of our Phase I work, the Torch Team proposes to execute laboratory-based experiments to elucidate fundamental micro-debris formation mechanisms to improve optical modeling of impacts. Optical signatures from impacts collected over the last decade have identified definitive micro-debris parameter trends. However, current theories have difficulty reproducing these optical ob ...

    STTR Phase II 2015 Department of DefenseMissile Defense Agency
  5. Lightweight, Stable Optical Bench with Integrated Vibration Attenuation

    SBC: SAN DIEGO COMPOSITES, INC.            Topic: MDA13T007

    The goal of this program is to design a lightweight optical bench capable of remaining stable under temperature and moisture changes, while isolating the precision optical array from vibrations such as engine noise and air turbulence. By integrating a customizable periodic stack in the bench, vibrations are attenuated more effectively than commercially available mounts. Additionally, the periodic ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  6. A Novel, Microscale, Distributable Sensor Technology for Ionizing Radiation

    SBC: CFD Research Corporation            Topic: DTRA14B004

    Terrorist use of radioactive nuclear materials via nuclear and/or radiological dispersion devices (dirty bombs) is a serious threat. Therefore, it is critical to detect the proliferation of nuclear material. Critical challenges facing this objective include: (a) high sensitivity detection of signature emissions (e.g., gamma rays) from common radioactive isotopes behind shielding, and (b) cost-effe ...

    STTR Phase I 2015 Department of DefenseDefense Threat Reduction Agency
  7. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD Research Corporation            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  8. Retrofittable and Transparent Super-Insulator for Single-Pane Windows

    SBC: NANOSD, INC.            Topic: DEFOA0001429

    NanoSD, Inc. with its partners will develop a transparent, nanostructured thermally insulating film that can be applied to existing single-pane windows to reduce heat loss. To produce the nanostructured film, the team will create hollow ceramic or polymer nanobubbles and consolidate them into a dense lattice structure using heat and compression. Because it is mostly air, the resulting nanobubble s ...

    STTR Phase II 2016 Department of EnergyARPA-E
  9. Infectious Disease Diagnostics and Differentiation of Viral vs. Bacterial Infections for Point of Care Applications

    SBC: GENECAPTURE            Topic: CBD15C001

    The modern warfighter faces the constant threat of endemic infections, multi-drug resistant bacteria and Biological Warfare Agents. In order to provide accurate front-line treatment that will curtail the overuse of antibiotics, a rapid and robust molecula

    STTR Phase I 2016 Department of DefenseOffice for Chemical and Biological Defense
  10. Development of powder bed printing (3DP) for rapid and flexible fabrication of energetic material payloads and munitions

    SBC: MAKEL ENGINEERING, INC.            Topic: DTRA16A001

    This program will demonstrate how additive manufacturing technologies can be used with reactive and high energy materials to create rapid and flexible fabrication of payload and munitions. Our primary approach to this problem will be to use powder bed binder printing techniques to print reactive structures. The anticipated feedstock will consist of composite particles containing all reactant spe ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
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