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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. An Embedded Health Monitoring System for Determining Readiness of Electronic Components

    SBC: NOKOMIS INC            Topic: MDA14T001

    Nokomis ultra-sensitive radio frequency (RF) sensor, the Hiawatha System, can leverage changes in unintended emissions signatures to monitor the overall state of electronic device health. As a device ages, emissions signatures change in a predictable and deterministic manner, enabling reliable determination of device readiness. Under this effort, Nokomis proposes to leverage hand-held embedded h ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  2. An Embedded Health Monitoring System for Determining Readiness of Electronic Components

    SBC: NOKOMIS INC            Topic: MDA14T001

    The MDA is in need of a robust, holistic Electronics Health Monitoring (EHM) solution that can address mission readiness concerns. Nokomis solution to this problem provides unique information to operators and maintainers and a more complete picture of component readiness. Nokomis novel methodologies for determining device health, whereby changes in unintended RF emissions signatures are leverage ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  3. Base Metal Electrode Capacitor Test Methods

    SBC: FUNDO SCIENCE CORPORATION            Topic: MDA14T003

    Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  4. CCA-SAFE: A Model-Assisted NDE Tool for Failure Analysis of Gold Contaminated Solder Joints

    SBC: Intelligent Automation, Inc.            Topic: MDA15T005

    Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  5. Common Situation Awareness Tool (CSAT)

    SBC: TIER 1 PERFORMANCE SOLUTIONS LLC            Topic: MDA13T004

    Tier1 Performance Solutions proposes to develop CSAT (Common Situation Awareness Tool), a solution that supports more effective event integration and task management, in order to improve situation awareness and knowledge sharing for missile defense system users and stakeholders. At the core of the CSAT solution is an active knowledge management platform designed so that all users share a common sc ...

    STTR Phase I 2014 Department of DefenseMissile Defense Agency
  6. Corrosion Protection of High-Value Test&Evaluation Assets

    SBC: ESPIN TECHNOLOGIES, INC.            Topic: MDA13T010

    This STTR Phase I proposal proposes to design and develop reactive filter media using nanofiber technology to capture corrosion inducing particulate matter present in coastal region air. The fibrous filter media will be functionalized using ion exchange chemistry which is known to react with salt ions. The media will be characterized for its filtration performance, resistance to airflow, and dus ...

    STTR Phase I 2014 Department of DefenseMissile Defense Agency
  7. Enhancement of Ballistic Missile Defense System Level Simulation Operations Through Multi-core Processing

    SBC: ISSAC Corp            Topic: MDA13T003

    The ISSAC team (ISSAC Corp and Oak Ridge National Labs) provides a novel, formalism-based approach that will allow legacy simulations to leverage current, state-of-the-art computational power to expedite execution and coverage of a vast parameters space. The ISSAC team will leverage existing corporate capabilities and innovative methodologies rooted in formal mathematics and decades of experience ...

    STTR Phase I 2014 Department of DefenseMissile Defense Agency
  8. Enhancement of Ballistic Missile Defense System Level Simulation Operations Through Multi-core Processing

    SBC: ISSAC Corp            Topic: MDA13T003

    The ISSAC Team propose a novel method to encapsulate legacy models and simulations that allows these components to take advantage of modern, multi-core, multi-processor hardware suites. Encapsulating these legacy codes provides 3 primary advantages to deal with complex systems and systems of systems (Air Force, Navy, Department of Homeland Security (DHS), Federal Emergency Management Agency (FEMA) ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  9. First-principles-based framework for discovery and design of sustainable non-rare-earth high-temperature alloy systems

    SBC: CFD RESEARCH CORPORATION            Topic: OSD12T06

    The aim of this STTR program is to develop protocols to discover rare-earth-free/rare-earth-lean magnetic alloys for replacing rare earth (RE) -based alloys for reducing the dependence of supply from China. The development of non-RE high temperature magnetic materials is very challenging. In Phase I, CFDRC in collaboration with its university partner has demonstrated a proof-of-concept computation ...

    STTR Phase II 2014 Department of DefenseOffice of the Secretary of Defense
  10. Gold-Contaminated Solder-Joint Characterization for Quantifying Risk Associated with Gold Embrittlement

    SBC: Enig Associates, Inc.            Topic: MDA15T005

    Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
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