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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Adaptive Management and Mitigation of Uncertainty in Fusion (AMMUF)

    SBC: Charles River Analytics, Inc.            Topic: MDA13T001

    In our Adaptive Management and Mitigation of Uncertainty in Fusion (AMMUF) project, we will model the entire multi-sensor fusion process as a probabilistic model and reason about the different design and algorithmic decisions that can be made by system engineers. This fusion model will use standard fusion system representations and ideas from statistical relational learning field to create flexibl ...

    STTR Phase II 2015 Department of DefenseMissile Defense Agency
  2. Base Metal Electrode Capacitor Test Methods

    SBC: FUNDO SCIENCE CORPORATION            Topic: MDA14T003

    Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  3. CCA-SAFE: A Model-Assisted NDE Tool for Failure Analysis of Gold Contaminated Solder Joints

    SBC: Intelligent Automation, Inc.            Topic: MDA15T005

    Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  4. Decision Making under Uncertainty

    SBC: GCAS, Inc.            Topic: MDA13T001

    Our proposed second order uncertainty (SOU) product is a decision making software solution that addresses the problem of providing accurate and precisely defined decision courses of action (COAs) of complex, time-constrained problems in a fraction of the time required by alternative methods striving to achieve the same level of precision. Complex decision situations can deal with large volume of ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  5. Deep Inference and Fusion Framework Utilizing Supporting Evidence (DIFFUSE)

    SBC: BOSTON FUSION CORP            Topic: MDA15T001

    Combining information from disparate sensors can lead to better situational awareness and improved inference performance; unfortunately, traditional multi-sensor fusion cannot capture complex dependencies among different objects in a scene, nor can it exploit context to further boost performance. Integrating context information within a fusion architecture to reason cohesively about scenes of inte ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  6. Deep Machine learning for risk Analysis and Prediction (D-MAP) in supply chains

    SBC: Intelligent Automation, Inc.            Topic: MDA16T002

    Globalization and digitization have been driving the recent economic growth at the expense of raising the risk level in the supply chain related to fraud, security, and safety, while current practice of supply chain management and risk assessment is lagging far behind. Therefore, commercial industries and government agencies are seeking advanced supply chain risk assessment solutions, which can ef ...

    STTR Phase II 2018 Department of DefenseMissile Defense Agency
  7. Enhancement of Ballistic Missile Defense System Level Simulation Operations Through Multi-core Processing

    SBC: ISSAC Corp            Topic: MDA13T003

    The ISSAC Team propose a novel method to encapsulate legacy models and simulations that allows these components to take advantage of modern, multi-core, multi-processor hardware suites. Encapsulating these legacy codes provides 3 primary advantages to deal with complex systems and systems of systems (Air Force, Navy, Department of Homeland Security (DHS), Federal Emergency Management Agency (FEMA) ...

    STTR Phase II 2016 Department of DefenseMissile Defense Agency
  8. Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and Design

    SBC: Space Micro Inc.            Topic: MDA14T002

    Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  9. Fine Powder Cathode and Separator Binder Characterization for Thermal Batteries

    SBC: CFD RESEARCH CORP            Topic: MDA16T001

    Fine powder thermal battery cathode materials can exhibit challenging flow properties which makes processing with automated presses difficult.Granulating these powders can substantially improve flow properties and reduce the tendency for powder segregation during handling and pressing operations.Additionally, the properties of MgO that lead to good performance in thermal battery separators are not ...

    STTR Phase II 2018 Department of DefenseMissile Defense Agency
  10. Gold-Contaminated Solder-Joint Characterization for Quantifying Risk Associated with Gold Embrittlement

    SBC: Enig Associates, Inc.            Topic: MDA15T005

    Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
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