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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

Displaying 1 - 10 of 40 results
 
  • Record 1 TO 40

  1. N/A

    SBC: Boston Nitride Technologies, Inc.            Topic: N/A

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    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  2. N/A

    SBC: Boston Nitride Technologies, Inc.            Topic: N/A

    N/A

    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  3. N/A

    SBC: Chemat Technology, Inc.            Topic: N/A

    N/A

    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  4. N/A

    SBC: COHERENT TECHNOLOGIES, INC.            Topic: N/A

    N/A

    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  5. N/A

    SBC: METAL MATRIX CAST COMPOSITES, LLC (DBA M            Topic: N/A

    N/A

    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  6. N/A

    SBC: METAL MATRIX CAST COMPOSITES, LLC (DBA M            Topic: N/A

    N/A

    STTR Phase II 2000 Department of DefenseMissile Defense Agency

  7. N/A

    SBC: Intelligent Automation, Inc.            Topic: N/A

    N/A

    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  8. N/A

    SBC: PACIFIC WAVE INDUSTRIES, INC.            Topic: N/A

    N/A

    STTR Phase I 2000 Department of DefenseMissile Defense Agency

  9. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD RESEARCH CORPORATION            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency

  10. Base Metal Electrode Capacitor Test Methods

    SBC: FUNDO SCIENCE CORPORATION            Topic: MDA14T003

    Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
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