Award Data

Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

Our proposed second order uncertainty (SOU) product is a decision making software solution that addresses the problem of providing accurate and precisely defined decision courses of action (COAs) of complex, time-constrained problems in a fraction of the time required by alternative methods striving to achieve the same level of precision. Complex decision situations can deal with large volume of ...

State of the art power hardware-in-the-loop (PHIL) and controller hardware-in-the-loop (CHIL) methods and testbed are used to evaluate naval ship power architectures. An innovative approach is proposed to leverage these capabilities to generate an architecture and toolkit that provide near real-time digital emulated system-in-the-loop capabilities and code execution testing for missile defense sys ...

The ISSAC Team propose a novel method to encapsulate legacy models and simulations that allows these components to take advantage of modern, multi-core, multi-processor hardware suites. Encapsulating these legacy codes provides 3 primary advantages to deal with complex systems and systems of systems (Air Force, Navy, Department of Homeland Security (DHS), Federal Emergency Management Agency (FEMA) ...

Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...

Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

The proposed work will develop a massively parallelized architecture for Monte Carlo simulation of real-time fire control schedulers. The parallelized architecture will utilize the recent developments in multiprocessing/multithreading technology based on graphical processing units. The system will be designed to perform in real-time assuming non-collocated sensors observing the threats and then co ...

The objective of this project is to develop a capability to model fracture of materials used in hypersonic vehicles that results from hypervelocity impact while exposed to extreme temperatures. Symplectic Engineering’s approach addresses this challenge at two levels. At the computational level, a Relaxed Extended Finite Element approach is pursued to represent (possibly intersecting) fractures l ...

This STTR research study aims to enhance and apply thermo-mechanically coupled computational models for high-temperature fracture. This topic is particularly challenging in that hypersonic flight in the atmosphere generates extreme conditions over a vehicle that can affect the strength and performance the vehicle materials, both in-flight conditions as well as for cases where the vehicle encounter ...