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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Base Metal Electrode Capacitor Test Methods

    SBC: FUNDO SCIENCE CORPORATION            Topic: MDA14T003

    Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  2. Application Specific Integrated Circuit for Avionic Component Health Monitoring

    SBC: MANAGEMENT SCIENCES INC            Topic: MDA14T001

    Management Sciences is widely recognized for its passive instrumentation module that runs Bayesian algorithms which monitor signatures to assess the health and remaining life of electronic and mechanical components. New Mexico Institute of Mining and Technology (NM Tech) is our research partner. Our approach is to translate a current microelectronic module into an 1-in x 1-in application specif ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  3. Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and Design

    SBC: Space Micro Inc.            Topic: MDA14T002

    Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  4. Micro-Particle Debris Characterization from Hyper-Velocity Impacts

    SBC: Torch Technologies, Inc.            Topic: MDA13T002

    Leveraging the results of our Phase I work, the Torch Team proposes to execute laboratory-based experiments to elucidate fundamental micro-debris formation mechanisms to improve optical modeling of impacts. Optical signatures from impacts collected over the last decade have identified definitive micro-debris parameter trends. However, current theories have difficulty reproducing these optical ob ...

    STTR Phase II 2015 Department of DefenseMissile Defense Agency
  5. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD RESEARCH CORP            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
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