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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Spatio-Temporal Association and Curve Kernels (STACKNet) for Multi-Cue Data Association

    SBC: Intelligent Automation, Inc.            Topic: MDA19T001

    Air and missile threats can fly highly maneuvering, complex trajectories. This poses a challenge to tracking algorithms during data association because of confusing targets, proximal detections and fast motion. In the proposed effort we propose to develop deep learning based technologies for data association to improve the accuracy of data association. Deep learning has shown significant gains in ...

    STTR Phase I 2020 Department of DefenseMissile Defense Agency
  2. Dynamic Emulated System In Loop

    SBC: Cardinal Engineering, LLC            Topic: MDA19T006

    State of the art power hardware-in-the-loop (PHIL) and controller hardware-in-the-loop (CHIL) methods and testbed are used to evaluate naval ship power architectures. An innovative approach is proposed to leverage these capabilities to generate an architecture and toolkit that provide near real-time digital emulated system-in-the-loop capabilities and code execution testing for missile defense sys ...

    STTR Phase I 2020 Department of DefenseMissile Defense Agency
  3. Inception: An Extendable Virtual Execution Framework to Support Dynamic Code Analysis of Embedded Systems

    SBC: Intelligent Automation, Inc.            Topic: MDA19T007

    In this proposed effort, we propose to develop an extendible virtual execution framework to support dynamic code analysis of embedded systems. The key innovation of this proposal includes developments of: (1) an extendible virtual processor module which can integrates heterogeneous Multiprocessor System on Chip (MPSOC) with different ISA (ARM, PowerPC, etc) and memory architecture; (2) an extendib ...

    STTR Phase I 2020 Department of DefenseMissile Defense Agency
  4. Monte Carlo Midcourse Interceptor Defense Agent-based Simulations (MCMIDAS)

    SBC: Intelligent Automation, Inc.            Topic: MDA19T008

    The Missile Defense Agency is constantly developing state-of-the-art anti-ballistic missile defense technologies and maintaining a constellation of defense platforms, known as Ballistic Missile Defense System (BMDS) to provide ultimate national security. BMDS consists of networked sensors for detection and tracking, interceptor missiles for destroying threats, and a Command Control Battle Manageme ...

    STTR Phase I 2020 Department of DefenseMissile Defense Agency
  5. DOEYK: Detecting Objects with Enhanced YOLOv3 and Knowledge Graph

    SBC: Intelligent Automation, Inc.            Topic: DTRA19B002

    Current state-of-the-art object detection algorithms are almost exclusively based on Deep Convolutional Neural Network (DCNN). These algorithms all require a large amount of labeled examples for each of the object categories they can recognize. These algorithms will fail for novel objects that only very few or even no prior examples are available. These algorithms are also far less accurate when c ...

    STTR Phase I 2020 Department of DefenseDefense Threat Reduction Agency
  6. Fully Metallic Self-Fragmenting Structural Reactive Materials Using Composites and Alloys Comprised of Aluminum, Lithium, and Magnesium

    SBC: Adranos Energetics LLC            Topic: DTRA16A002

    While aluminum casing materials provide some enhanced performance and thermal loading to explosive ordinance, their overall effectiveness is highly limited by incomplete combustion and long residence times. In order to reduce these problems, the casing material must be designed to facilitate rapid fragmentation through either specialized casing geometries or greatly refined initial particle sizes. ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  7. Innovative Mitigation of Radiation Effects in Advanced Technology Nodes

    SBC: RELIABLE MICROSYSTEMS LLC            Topic: DTRA16A003

    Establish a radiation-aware analysis capability in a commercial EDA design flow that will enable first-pass success in radiation-hardened by design (RHBD) for DoD ASICs in much the same way that existing EDA design suites ensure first pass functionality and performance success of complex ASICs destined for commercial applications. Layout-aware, calibrated single-event radiation models that captur ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  8. Sufficient Statistics for System of Systems Control (S4C)

    SBC: Intelligent Automation, Inc.            Topic: MDA15T002

    There is an urgent need to develop and demonstrate innovative control, design and analysis techniques to characterize the stability and performance of a system of systems (SoS) as a function of sub-system dynamics, network structure and control/decision processes. This is particularly true in the missile defense scenario, which involves a coordinated defense against threats. However, there is no e ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  9. Mechanistic Model Development for Gold Contaminated Solder Joint Reliability

    SBC: DFR SOLUTIONS, LLC            Topic: MDA15T005

    DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contaminatio ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  10. CCA-SAFE: A Model-Assisted NDE Tool for Failure Analysis of Gold Contaminated Solder Joints

    SBC: Intelligent Automation, Inc.            Topic: MDA15T005

    Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
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