The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until June, 2020.
SBC: INTERCAX, LLC Topic: N/A
This effort creates foundations for highly automated simulation tools that predict warpage in printed circuit boards and assemblies (PCAs/PCBs) and chip packages. Our technique, MHS, provides core capabilities to automate warpage and other problems that were impractical until now. MHS extends a multi-representation approach the PI first conceived at Georgia Tech for CAD-CAE interoperability. This ...SBIR Phase II 2006 Department of CommerceNational Institute of Standards and Technology