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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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Design and Realization of a Dual Function OCM/MPM for Imaging TEMPs
SBC: DISTANT FOCUS CORP Topic: N/ARegenerative medicine is an emerging, interdisciplinary field that will result in new engineered medical products. The introduction of a high-resolution, non-destructive imaging technique that is capable of penetrating deeply into the highly-scattering scaffold medium has the means to accelerate the development and commercial utilization of these novel materials. Multi-photon microscopy (MPM) is b ...
SBIR Phase II 2006 Department of CommerceNational Institute of Standards and Technology -
Construction of a Force Probe for Characterization of Microscale Features
SBC: INSITUTEC, INC. Topic: N/AThe Phase 2 objective is to provide NIST with a modular gauge head unit equipped with InsituTec's standing wave probe technology. The complete gauge head unit will be retrofitted to the NIST M48 which is one of the most precise measuring machines in the world. This unit will enable NIST to achieve the agency's program goal in dimensional metrology which is to provide microscale measurement capacit ...
SBIR Phase II 2006 Department of CommerceNational Institute of Standards and Technology -
A Multi-Representation Architecture for STEP AP210-based PCB Stackup Design and Warpage Analysis
SBC: INTERCAX, LLC Topic: N/AThis effort creates foundations for highly automated simulation tools that predict warpage in printed circuit boards and assemblies (PCAs/PCBs) and chip packages. Our technique, MHS, provides core capabilities to automate warpage and other problems that were impractical until now. MHS extends a multi-representation approach the PI first conceived at Georgia Tech for CAD-CAE interoperability. This ...
SBIR Phase II 2006 Department of CommerceNational Institute of Standards and Technology