The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until September, 2020.
SBC: INTERCAX, LLC Topic: N/A
This effort creates foundations for highly automated simulation tools that predict warpage in printed circuit boards and assemblies (PCAs/PCBs) and chip packages. Our technique, MHS, provides core capabilities to automate warpage and other problems that were impractical until now. MHS extends a multi-representation approach the PI first conceived at Georgia Tech for CAD-CAE interoperability. This ...SBIR Phase II 2006 Department of CommerceNational Institute of Standards and Technology
SBC: STAR CRYOELECTRONICS LLC Topic: N/A
An innovative superconducting transition edge sensor (TES) microcalorimeter array with superconducting quantum interference device (SQUID) readouts is described for high energy and high spatial resolution X-ray energy dispersive spectroscopy and microanalysis. The proposed microcalorimeter instrument offers an energy resolution that is comparable to and potentially even better than wavelength disp ...SBIR Phase I 2004 Department of CommerceNational Institute of Standards and Technology