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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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Protein Qspec: An Improved Method for Rapid Characterization of Protein Aggregates in Biologic Drugs for Increased Quality and Safety
SBC: OPTOFLUIDICS, INC. Topic: 90201Optofluidics will develop Protein Qspec, a new particle analysis QC instrument designed to characterize protein aggregates in biologic drugs. The primary concern for this class of therapeutics is that they can elicit an immune response from patients who develop anti-drug antibodies which can eliminate the therapeutic benefit. The presence of particulate matter, in these therapeutics (e.g. shed gla ...
SBIR Phase I 2016 Department of CommerceNational Institute of Standards and Technology -
Rapid and Agile Detection of Counterfeit Electronics using Enhanced ADEC Technology
SBC: NOKOMIS INC Topic: DMEA152001Counterfeit and maliciously modified electronics can disrupt, disable, and subvert Department of Defense (DoD) weapons systems crucial tonational security. When coupled with the growing sophistication of counterfeits and physical malware, the need for advanced detection technologyis apparent. Conventional screening technologies have proven incapable of robust and reliable counterfeit detection. So ...
SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity -
A Multi-Representation Architecture for STEP AP210-based PCB Stackup Design and Warpage Analysis
SBC: INTERCAX, LLC Topic: N/AThis effort creates foundations for highly automated simulation tools that predict warpage in printed circuit boards and assemblies (PCAs/PCBs) and chip packages. Our technique, MHS, provides core capabilities to automate warpage and other problems that were impractical until now. MHS extends a multi-representation approach the PI first conceived at Georgia Tech for CAD-CAE interoperability. This ...
SBIR Phase II 2006 Department of CommerceNational Institute of Standards and Technology