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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance

    SBC: CFD RESEARCH CORPORATION            Topic: MDA14T002

    Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  2. Base Metal Electrode Capacitor Test Methods

    SBC: FUNDO SCIENCE CORPORATION            Topic: MDA14T003

    Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  3. Failure Avoidance in Microelectronics Due to Coefficient of Thermal Expansion (CTE) Mismatch of Substrates and Adhesives

    SBC: GLOBAL ENGINEERING RESEARCH AND TECHNOLOGIES, LLC            Topic: MDA14T002

    The reliability of electronic packages is of paramount concern in todays electronics industry, and ensuring their thermomechanical integrity is necessary to achieve this reliability. However, this task has become more challenging with miniaturization and the introduction of new materials. Thermal stresses in electronic packages continue to be one of the leading causes of device failure. The pro ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  4. Novel Autonomous Ultrasonic System for Monitoring the Remaining Effective Stabilizer in Aging Rocket Propellants

    SBC: LUNA INNOVATIONS INCORPORATED            Topic: MDA14T004

    Luna proposes a novel technique for the accurate quantification of the remaining effective stabilizers (RES) in solid rocket propellants. This sensing concept does not require access into the solid rocket motor (SRM). Therefore this approach does not in any way compromise the integrity of the motor and it can retrofit legacy systems and can be part of the next generation of motor systems and wil ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  5. Advanced Electroanalytical Methods for Failure Mode Analysis and Screening of Base Metal Capacitors

    SBC: MAINSTREAM ENGINEERING CORP            Topic: MDA14T003

    Over 95% of the multilayer ceramic capacitors manufactured worldwide use base metal electrode (BME) technology and they are one of the key components in much of the modern electronics. BME capacitors have, over the last 20 years, made significant improvements in performance and reliability; making them more competitive for a wide range of applications. However, there remains significant concerns ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  6. Weapon Inspection Sustainment and Recording Device (WISARD)

    SBC: MAINSTREAM ENGINEERING CORP            Topic: MDA14T001

    The process by which weapon systems go from point of manufacture to field usage is not a simple one. Devices can be held in storage for decades before use, and they can be subjected to significant and potentially damaging environmental conditions throughout the systems lifecycle. Latent and intermittent failures occur, and it is difficult to detect these malfunctions without actively monitoring ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  7. Application Specific Integrated Circuit for Avionic Component Health Monitoring

    SBC: MANAGEMENT SCIENCES INC            Topic: MDA14T001

    Management Sciences is widely recognized for its passive instrumentation module that runs Bayesian algorithms which monitor signatures to assess the health and remaining life of electronic and mechanical components. New Mexico Institute of Mining and Technology (NM Tech) is our research partner. Our approach is to translate a current microelectronic module into an 1-in x 1-in application specif ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  8. An Embedded Health Monitoring System for Determining Readiness of Electronic Components

    SBC: NOKOMIS INC            Topic: MDA14T001

    Nokomis ultra-sensitive radio frequency (RF) sensor, the Hiawatha System, can leverage changes in unintended emissions signatures to monitor the overall state of electronic device health. As a device ages, emissions signatures change in a predictable and deterministic manner, enabling reliable determination of device readiness. Under this effort, Nokomis proposes to leverage hand-held embedded h ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  9. Real-Time Health Management Portable Sensor for Solid Rocket Motors

    SBC: PHYSICAL SCIENCES INC.            Topic: MDA14T004

    Physical Sciences Inc. (PSI) proposes to design, develop, and demonstrate a portable, non-invasive, real-time sensor to assess the chemical and physical health of solid rocket motors (SRMs) as a function of age without affecting the motors integrity. In Phase I, a sensor to monitor specific gas species that are markers of the chemical and mechanical aging processes of composite and double base pr ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
  10. Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and Design

    SBC: Space Micro Inc.            Topic: MDA14T002

    Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...

    STTR Phase I 2015 Department of DefenseMissile Defense Agency
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