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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. DIGESTIVE ENZYME SUPPLEMENTS TO INERT FEEDS FOR SMALL-EGG FISH LARVAE

    SBC: International Aquaculture Res            Topic: N/A

    INADEQUATE STARTER FEEDS SEVERELY HOLD BACK NEW AQUACULTURE ENTERPRISES SUCH AS PRESENT ATTEMPTS TO RAISE FISHES WHOSE LARVAE DEVELOP FROM SMALL EGGS AND HAVE VERY "DIFFICULT" FOOD REQUIREMENTS. INERT LARVAL FEEDS HAVE NOT SUCCESSFULLYELIMINATED THE STRICT DEPENDENCY ON NATURAL FORAGE DURING THE CRITICAL POST-LARVAL STAGE AFTER YOLK ABSORPTION AND BEFORE THE DEVELOPMENT OF A DIGESTIVE SYSTEM WITH ...

    SBIR Phase I 1987 Department of Commerce
  2. PERMEABILITY OF HYDROGEN IN SILICON

    SBC: ISOTHERMAL SYSTEMS RESEARCH            Topic: N/A

    N/A

    SBIR Phase I 1990 Department of DefenseMissile Defense Agency
  3. Spray Cooling of "Tuna-fish-can" Size High Performance Electronic Multi-Chip Modules

    SBC: ISOTHERMAL SYSTEMS RESEARCH            Topic: N/A

    The project objective is to fabricate high-strength shapes from composite materials without the use of dies, molds, or any type of dedicated tooling. In the process, a "forming master" is created from deformable sheet material on a first pass through the molding apparatus. In successive passes, plies of composite materials are overlaid on the master and consolidated by the apparatus. These sequent ...

    SBIR Phase I 1992 Department of DefenseMissile Defense Agency
  4. Spray Cooling Of High-power Semiconductor Laser Diodes

    SBC: ISOTHERMAL SYSTEMS RESEARCH            Topic: N/A

    THE CURRENT DEVELOPMENT OF HIGH PERFORMANCE LASER DIODES TO BE USED IN DEFENSE, SUPER COMPUTERS, TELECOMMUNICATIONS, AND MEDICINE HAS INTRODUCED A NEED FOR A RADICAL CHANGE IN THE APPROACH OF LASER DIODE/OPTICS THERMAL MANAGEMENT. IN LASER DIODE ARRAYS, INTEGRATED CIRCUITS MOUNTED TOGETHER ON A SINGLE SUBSTRATE TO FORM ONE LEVEL PACKAGE ALLOW HIGHER LASER INTENSITIES, VARIED FREQUENCIES AT ENORMOU ...

    SBIR Phase I 1993 Department of DefenseMissile Defense Agency
  5. DIGITAL FLASH FLOOD WARNING SYSTEM

    SBC: Trinity            Topic: N/A

    IN THE PAST DECADE MAJOR ADVANCES HAVE BEEN MADE TO MEET THE COMPLICATED FLOOD DETECTION AND WARNING REQUIREMENTS OF DEVELOPED COMMUNITIES. COMPUTERIZED TELEMETRY SYSTEMS HAVE MET THE NEED WITH SOPHISTICATED HARDWARE AND SOFTWARE TO MONITOR, PREDICT, AND OFFER STRATEGIES. OVERLOOKED ARE SMALL COMMUNITIES AND PROPERTY OWNERS WITH LIMITED RESOURCES WHO MUST RELY ON OUTDATED TECHNOLOGY FOR PROTECTION ...

    SBIR Phase I 1993 Department of Commerce
  6. Rectifying Junctions for High Temperature, High Power Electronics

    SBC: 3c Semiconductors            Topic: N/A

    N/A

    SBIR Phase I 1995 Department of DefenseMissile Defense Agency
  7. On-Wafer Measurement Accuracy Assessment Tool Kit

    SBC: Cascade Microtech, Inc.            Topic: N/A

    The traceability of on-wafer calibration standards has long been an issue among the microwave measurement community, and the proliferation of new calibration methods, elements, and applications only exacerbates the problem. This diversity in calibration needs has made traceability of a physical reference impractical. As a result, the NIST developed a procedure which can compare on-wafer calibrat ...

    SBIR Phase I 1995 Department of Commerce
  8. Rectifying Junctions for High Temperature, High Power Electronics

    SBC: 3c Semiconductors            Topic: N/A

    The single most important type of metal/SiC junction is the n-type, rectifying Schottky diode, because it is the voltage blocking junction in all majority carrier devices. A reliable junction of this type for n-type SiC is the key to its development for high temperature, power conditioning electronics. Phase I will demonstrate that osmium is the ideal metal for forming such junctions. Phase II wil ...

    SBIR Phase II 1996 Department of DefenseMissile Defense Agency
  9. Implementation of High-GHz-to-THz Optical Data Links

    SBC: TEMPLEX TECHNOLOGY CORP.            Topic: N/A

    N/A

    SBIR Phase I 1996 Department of DefenseMissile Defense Agency
  10. Software for Weld Sensing and Control

    SBC: ANAMED, INC.            Topic: N/A

    Gas Metal Arc Welding (GMAW) accounts for a significant proportion of all welding performed. Due to its relatively high speeds and metal deposition rates as well as relatively low equipment and maintenance costs, it is also the most popular process for automated, and especially robotic, welding. There are, however, problems that significantly restrict its manufacturing applications. The efforts at ...

    SBIR Phase I 1997 Department of Commerce
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