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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
  2. High Rate Single Photon Sensitive Coded LADAR Receiver

    SBC: VOXTEL, INC.            Topic: MDA09038

    There is a need for a high-resolution two-dimensional focal plane array (FPA) with single photon sensitivity (SPS), pulse amplitude storage, and GHz bit rates that can record both the time (with 10 bits) from multiple returns from a single laser pulse. Such a system has the potential to significantly reduce LADAR size, weight, and power (SWAP) by alleviating the laser requirements. In this program ...

    SBIR Phase I 2010 Department of DefenseMissile Defense Agency
  3. Large-Format Dual-Use Radiation-Hard ROIC for IRFPAs and Star-Trackers

    SBC: VOXTEL, INC.            Topic: MDA09014

    New, modular radiation hard [>300 kRad (Si)] ROIC designs are required to address the needs of planned ballistic missile defense system. Anticipating the needs for large formats, small pixel sizes, and multiple spectral bands, the features of an existing radiation-hard space imager ROIC will be used to develop the design of an extensible 1024 × 1024, 15-μm pixel ROIC design. The design includes ...

    SBIR Phase I 2010 Department of DefenseMissile Defense Agency
  4. Non-Avalanche Gain Detector for High-Resolution Single-Photon and Dual Mode Applications

    SBC: VOXTEL, INC.            Topic: MDA09002

    Future seekers of the future will need to allow for multiple targets and various advanced countermeasures, likely including a dual-mode component to do so. A Dual Mode Seeker (DMS) has at least an infrared (IR) Focal Plane Array (FPA) as well as an active means to capture target range and preferably 3-D imagery. Future technology insertion will benefit from a monolithic dual mode focal plane, wher ...

    SBIR Phase I 2010 Department of DefenseMissile Defense Agency
  5. High Efficiency, Large-Area, 1550 nm InGaAs Photodiodes

    SBC: VOXTEL, INC.            Topic: N/A

    A back-illuminated planar InGaAs photodiode tested to have 95% quantum effiiency (QE) at 1550 nm, area greater than 1 mm2, low capacitance (125 MHz) will be improved. Although the existing Phase I device exhibited bulk material dark current generation better than commercially available devices, the sidewall-generated dark current was found to dominate the noise equiva ...

    SBIR Phase II 2010 Department of CommerceNational Institute of Standards and Technology
  6. Interceptor Seekers

    SBC: VOXTEL, INC.            Topic: MDA08002

    A 128 x 128-format avalanche photodiode (APD) focal plane array (FPA), including a low-power dual-mode readout integrated circuit (ROIC) and low excess noise, high gain (M>1,200) will be developed for laser radar (LADAR) applications requiring reduced SWAP. The FPA gives LADAR seekers an advanced active tracking sensor capability, providing a sufficiently wide field of regard (FOR) to eliminate th ...

    SBIR Phase II 2010 Department of DefenseMissile Defense Agency
  7. Ultra High-Speed Video Processing for High Resolution Electro-Optical Sensors

    SBC: STIMULUS Engineering Services, Inc.            Topic: MDA09011

    The Missile Defense Agency (MDA) is developing a new kill vehicle to be employed as part of a missile system upgrade program. One of the performance enhancements under consideration involves improving performance through the integration of data from three sensors, each operating in a different spectral range, with both active and passive capability. This document proposes a unique and novel approa ...

    SBIR Phase I 2010 Department of DefenseMissile Defense Agency
  8. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
  9. Novel multilayer MIM Damascene Capacitor

    SBC: American Semiconductor, Inc.            Topic: N/A

    "This proposal is for a (Metal Insulator Metal) MIM multilayer capacitor design that achieves higher capacitance density through the use of large electrode surface area within a small chip dimension utilizing a high-k dielectric in a multi-Damascenefabricated approach consistent with low temperature process requirements. Capacitors, either realized as discrete elements in thin-film technologies, o ...

    SBIR Phase I 2002 Department of DefenseMissile Defense Agency
  10. Foundry Flexfet(c)SOI, a Commercial Revolution in Rad-Hard Processing

    SBC: American Semiconductor, Inc.            Topic: N/A

    "Low cost, high-frequency, radiation-tolerant wafer fabrication for next generation electronic circuits is limited by domestic manufacturing capability. General availability of inherently radiation tolerant silicon-on-insulator (SOI) process technology tothe fabless design community is limited to only one viable domestic source. This proposal presents the opportunity to create U.S. foundry manufa ...

    SBIR Phase I 2002 Department of DefenseMissile Defense Agency
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