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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Chemical Vapor Deposition of Beta-BaB2O4 (BBO) for Integrated Nonlinear Optics

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    The superior optical properties of BBO and its applicability in frequency doublers and waveguides justifies development of thin film deposition processes which can be integrated with microelectronic processing. The high damage threshold of BBO, a necessary component for device integrity, is a major advantage over other nonlinear optic materials. In Phase I, chemical precursors and a deposition pro ...

    SBIR Phase I 1995 Department of DefenseMissile Defense Agency
  2. Multi-Spectral Semiconductor Ultraviolet Detector

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    We propose to demonstrate the feasibility of solar-blind, multi-spectral III-V nitride UV detectors which can meet the requirements of applications in both the military and commercial sectors (missile threat warning, UV search and track, environmental monitoring in gas turbines, and general flame detection). A novel aspect of our approach is the use of SiC as a substrate for these devices, which w ...

    SBIR Phase I 1995 Department of DefenseMissile Defense Agency
  3. Chemical Vapor Desposition of PLZT for Low Cost SLM Manufacturing

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Spatial light modulators (SLM's) have been identified as critical elements in many optical computing and signal processing applications. Typically these devices use expensive bulk ceramics that result in high cost and difficult device integration. Ceramic materials in the PbLaZrTiO3 (PLZT) family of compounds show a unique combination of high transparency, large electrooptic effects and exceptio ...

    SBIR Phase I 1995 Department of DefenseAir Force
  4. Gas-Phase Deposition of Low Dielectric Polymers

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Phase I will develop a gas-phase process for the deposition of low dielectric constant polymers for use in integrated circuits. This process will utilize the firm's liquid delivery technology to deliver the reactants and grow films at high deposition rates. Polymerization will be induced by thermal activation on a heated substrate. This novel approach to polymeric film growth enables the depositio ...

    SBIR Phase I 1995 Department of DefenseMissile Defense Agency
  5. Radiation Tolerant Memory Device Materials

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Radiation hardened ferroelectric random access memory (FRAM) devices have potential uses in numerous military applications. Until recently, FRAMs have relied on lead zirconate titanate (PZT) as the storage material. However, a new class of materials promises to offer higher device reliability and easier integration into existing technologies. SrBi2Ta209 has been identified as a material of choice ...

    SBIR Phase I 1995 Department of DefenseMissile Defense Agency
  6. Lattice Matched III-V Nitride Heterostructures

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    The III-V nitrides have recently emerged as the primary material system for UV/blue light emitters. Higher bandgap energy (Al,Ga)N alloys are currently employed as cladding layers for GaN and (In,Ga)N active region LEDs and laser structures. Lattice mismatch between the cladding and active regions, however, restricts both the thickness and composition of the layers which in turn limits the operati ...

    SBIR Phase I 1996 Department of DefenseMissile Defense Agency
  7. High Temperature SiC Power MOSFETs

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Large power handling systems of 1KW to 150KW are required in a many applications ranging from aerospace to consumer electronics to industrial power systems and transportation. Conventional electronic systems, based on silicon or gallium arsenide devices, require a large number of devices enhanced with extra heat sinking and sophisticated control systems to ensure synchronous operation. The extra ...

    SBIR Phase I 1996 Department of DefenseMissile Defense Agency
  8. Silicon Carbide UV Photodiode Arrays

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    UV diode detector arrays have a wide range of both commercial and military applications. Examples include spectral measurement and calibration, pollution monitoring, environmental change monitoring, remote sensing of earth resources, solar UV monitoring, burner monitoring in gas turbines, flame detection in furnaces and for fire detections, etc. SiC is one of the most promising material for UV di ...

    SBIR Phase I 1995 Department of Commerce
  9. In-Cylinder Micromachined Pressure Transducers

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Increasingly strict emissions requirements and the need to increase fuel economy and reduce service intervals have dramatically accelerated the use of monitor and control electronics in engines. traditional methods such as adjusting the air/fuel ratio to optimize catalyst performance are not effective enough to meet future requirements. Measurement of the pressure in each cylinder permits enhanc ...

    SBIR Phase I 1996 Department of DefenseArmy
  10. Interconnect Technology for High Temperature SiC Integrated Circuits

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Integration of many different devices on a single silicon carbide (SiC) substrate is necessary to realize the full potential of high temperature or high power devices for markets ranging from industrial and consumer to military systems to transportation power and control. Integration requires that the entire device package, individual devices, contacts and interconnect materials, be ...

    SBIR Phase I 1996 Department of DefenseAir Force
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