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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. NOVEL AIR GAP INSULATED PISTON

    SBC: ADIABATICS INC            Topic: N/A

    ADIABATICS, INC. IS PLEASED TO PROPOSE A RESEARCH PROGRAM TO DESIGN AN OPTIMUM PISTON FOR A HIGH TEMPERATURE MILITARY ENGINE. ADIABATICS, INC. HAS BEEN CONDUCTING A PROGRAM FOR TACOM TITLED "DEVELOPMENT OF TRIBOLOGICAL SYSTEMS AND ADVANCED HIGH TEMPERATURE IN-CYLINDER COMPONENTS FOR ADVANCED HIGH TEMPERATURE DIESEL ENGINES" FOR THE PAST FIVE YEARS. BASED ON OUR EXPERIENCE WITH DESIGNING COMPONENTS ...

    SBIR Phase II 1993 Department of DefenseArmy
  2. IMPROVED STEADY-STATE INITIALIZATION ALGORITHMS FOR COMPUTER CODES

    SBC: Compu Simulation & Anal I            Topic: N/A

    CSA PROPOSES TO DESIGN AND IMPLEMENT A STEADY-STATE SOLUTION FOR THE COMPLETE SYSTEM OF EQUATIONS SOLVED IN EITHER THE TRAC/PF1, TRAC/BD1, OF RELAP5 CODES. THE STEADY-STATE SOLUTION WILL UTILIZE THE STEADY-STATE FORM OF THE MODEL EQUATIONS AND WILL UTILIZE EXISTING EQUATION SOLVERS TO THE EXTENT POSSIBLE. ALL TIME-DEPENDENT CONSTITUTIVE AND COMPONENT MODELS WILL BE INCLUDED IN THE SOLUTION TO ENSU ...

    SBIR Phase II 1993 Nuclear Regulatory Commission
  3. ADVANCED COMPOSITE SOLDER FOR MICROELECTRONICS

    SBC: High Performance Materials, Inc.            Topic: N/A

    A DISPERSION AND COMPOSITE STRENGTHENING APPROACH INCORPORATING THE BENEFITS OF RAPID SOLIDIFICATION AND IN-SITU COMPOSITE FORMATION IS PROPOSED FOR THE DEVELOPMENT OF CREEP AND FATIGUE RESISTANT HIGH STRENGTH SOLDER ALLOYS AND COMPOSITES FOR ELECTRONICS PACKAGING APPLICATIONS . THE GOAL OF PHASE I OF THE PROGRAM IS TO DEMONSTRATE THE FEASIBILITY OF PRODUCING BY INDUCTION MELTING AND INERT GAS ATO ...

    SBIR Phase II 1993 Department of DefenseArmy
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