You are here

Award Data

For best search results, use the search terms first and then apply the filters
Reset

The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Optical Device for Sorting Particles by Size

    SBC: En'urga Inc.            Topic: NA

    This Phase II SBIR project will continue the development of an optical sorter that will be used to estimate drop sizes in sprays. The optical sorter will determine the size of drops in the 0.1 to 10 microns range. Drops in this size range are prevalent in the automobile industry, where the fuel injection pressures have increased tremendously over the past two decades. These newer injectors provide ...

    SBIR Phase II 2018 Department of CommerceNational Institute of Standards and Technology
  2. ISABEL- Integrated Secure Automated Bug Extraction List

    SBC: SMART INFORMATION FLOW TECHNOLOGIES LLC            Topic: NA

    To automatically detect software bugs, understand their characteristics, and categorize them according to the evolving NIST Bugs Framework (BF), SIFT is developing ISABEL: Integrated Secure Automated Bug Extraction List. ISABEL will provide three key functions:- Using symbolic analysis and fuzz-testing tools to find inputs that trigger vulnerabilities (bugs).- Using fuzz-testing, delta-debugging, ...

    SBIR Phase II 2018 Department of CommerceNational Institute of Standards and Technology
  3. Radiation Mitigating System-in-Package Electronics

    SBC: TRUSTED SEMICONDUCTOR SOLUTIONS INC            Topic: AF151089

    Trusted Semiconductor Solutions will demonstrate how high-reliability substrate material, leading-edge commercial memories, advanced manufacturing processing, and our radiation circumvention and recovery approach enables high density electronic payloads needed for next generation guided missile and space applications. We will develop a prototype system-in-package (SiP) that utilizes commercial mem ...

    SBIR Phase II 2018 Department of DefenseMissile Defense Agency
  4. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
  5. High Efficiency, Large-Area, 1550 nm InGaAs Photodiodes

    SBC: VOXTEL, INC.            Topic: N/A

    A back-illuminated planar InGaAs photodiode tested to have 95% quantum effiiency (QE) at 1550 nm, area greater than 1 mm2, low capacitance (125 MHz) will be improved. Although the existing Phase I device exhibited bulk material dark current generation better than commercially available devices, the sidewall-generated dark current was found to dominate the noise equiva ...

    SBIR Phase II 2010 Department of CommerceNational Institute of Standards and Technology
  6. Interceptor Seekers

    SBC: VOXTEL, INC.            Topic: MDA08002

    A 128 x 128-format avalanche photodiode (APD) focal plane array (FPA), including a low-power dual-mode readout integrated circuit (ROIC) and low excess noise, high gain (M>1,200) will be developed for laser radar (LADAR) applications requiring reduced SWAP. The FPA gives LADAR seekers an advanced active tracking sensor capability, providing a sufficiently wide field of regard (FOR) to eliminate th ...

    SBIR Phase II 2010 Department of DefenseMissile Defense Agency
  7. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
US Flag An Official Website of the United States Government