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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. High Efficiency, Large-Area, 1550 nm InGaAs Photodiodes

    SBC: VOXTEL, INC.            Topic: N/A

    A back-illuminated planar InGaAs photodiode tested to have 95% quantum effiiency (QE) at 1550 nm, area greater than 1 mm2, low capacitance (<23 pF), and high bandwidth (>125 MHz) will be improved. Although the existing Phase I device exhibited bulk material dark current generation better than commercially available devices, the sidewall-generated dark current was found to dominate the noise ...

    SBIR Phase II 2010 Department of CommerceNational Institute of Standards and Technology
  2. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
  3. Interceptor Seekers

    SBC: VOXTEL, INC.            Topic: MDA08002

    A 128 x 128-format avalanche photodiode (APD) focal plane array (FPA), including a low-power dual-mode readout integrated circuit (ROIC) and low excess noise, high gain (M>1,200) will be developed for laser radar (LADAR) applications requiring reduced SWAP. The FPA gives LADAR seekers an advanced active tracking sensor capability, providing a sufficiently wide field of regard (FOR) to eliminate th ...

    SBIR Phase II 2010 Department of DefenseMissile Defense Agency
  4. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency

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