Award Data

Advanced semiconductor devices form the heart of 21st Century technologies. The mission-critical role that these devices play demands exceptional levels of reliability. When a semiconductor device does fail, it is essential that the cause of the failure is identified as quickly as possible, Because of the daunting complexity of an integrated circuit, a significant amount of intricate material rem ...

XRadIC establishes an automated software framework to non-destructively analyze cutting edge microelectronics using photon flux-limited x-ray microscope systems. XRadIC couples on-the-fly sample scanning with online optimized 2D and 3D image analysis algorithms to maximize overall system throughput by dynamically minimizing the number of viewing angles and exposure times needed to analyze a given ...

The transmission electron microscope (TEM) is the standard high resolution tool for imaging microelectronics. Despite its impressive sensitivity to physical structure (the type, number, and arrangement of atoms), TEM is remarkably inept at detecting electronic and thermal signals, even when equipped with expensive spectroscopic attachments. Electronic and thermal structure determines device functi ...

Copia is a a fit-for-purpose sand-to-system supply chain blockchain optimized for DMEA’s FPGA Manufacturing ecosystem to enable Trusted and Assured Copia is a a fit-for-purpose sand-to-system supply chain blockchain optimized for DMEA’s FPGA Manufacturing ecosystem to enable Trusted and Assured Microelectronics requirements across DOD.

Phase II is the continuing effort to demonstrate the feasibility of producing an automated delayering and imaging system with end point detection, material density detection with built in neural network error correction. This process, coined fast Automated Delayering-Image Capture System (ADICS) leverages off of the existing Pix2Net which is a proven automated imaging 3D microchip reconstruction s ...

Infrared Laboratories proposes a direct to phase II program for delivering an electrical stimulation system to be used with DMEA’s existing IREM backside inspection system. Our delivered system will operate using proven technology that we will develop to work with DMEA’s existing tool. The system will be capable of using probe cards as well as individual micro manipulated probe tips to stimula ...

Communication SoC technology has advanced significantly over the past ten years resulting in highly integrated radio SoC chips for standards such as Wi-Fi, global position system (GPS), Bluetooth (BT), 3G cellular, digital TV (DTV), and cable modems. While most radio SoC"s are narrowband (e.g. WiFi, GPS, BT, and cellular), future trends favor broadband software defined radios (SDR) and cognitive r ...

To meet the demands of the DMEA182-002 SBIR solicitation (“Front End of Line and Back End of Line Layer Fabrication Partitioning for the Purpose of Design Intellectual Property Protection”), the MaXentric and UCLA team proposes the HIGHFIVE (Heterogeneous Integration Guideline Highlighting Fabrication of Information Veiled Electronics), which provides a practical verification flow using the ci ...

The trend of microelectronic processing technology is for more advanced complex devices integrated in smaller size. Particles could become significantly more prevalent as killer defects and have adverse effect on fabrication yield rate. Meanwhile, clean environment control requirements originally focused on particles in the air have been extended to encompass liquids that come into direct contact ...

This Phase II SBIR proposal aims to develop an x-ray illumination beam system comprising a dual-target x-ray source and a set of magnifying Wolter x-ray optics for use in laboratory-based integrated circuit (IC) inspection x-ray microscopes. Due to the increasing reliance on electronics for military systems and devices, a method to quickly analyze ICs in 3D is critical. X-ray microscopy enabled by ...