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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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Synthesizable Register Transfer Logic (RTL) Assertions
SBC: EDAPTIVE COMPUTING INC Topic: DMEA221001Verification and validation (V&V) of ICs have become progressively difficult as design complexity, the reuse of third-party intellectual property, and malicious attacks on microelectronics have all increased. Given these challenges, the DoD needs automated, user-friendly post-synthesis verification and validation solutions to assure its critical hardware systems. To address this need, ECI presents ...
SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity -
2nd Phase II Radiation Shielding (SI Technologies)
SBC: SI2 TECHNOLOGIES, INC Topic: MDA17012SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...
SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity -
Novel Manufacturing Process for Advanced Low-Cost High-Power Epitaxy Silicon Switches
SBC: RADIATION DETECTION TECHNOLOGIES, INC. Topic: DMEA231D01Currently, the US has limited production facilities for opening switches, e.g., DSRDs, which are manufactured with very outdated manufacturing methods and technology, e.g., based on deep diffusion of dopants into a thinned silicon wafer. The goal of this effort is to develop scaled manufacturing processes, manufacture batch quantities, and enable high-volume manufacturing of semiconductor opening ...
SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity -
Supply Chain Development of Thick SiC Epi-Wafers and 20 kV Class Transistors
SBC: MAINSTREAM ENGINEERING CORP Topic: DMEA231D02SiC IGBT devices remain restricted from achieving higher voltage operation due the lack of a supply chain (onshore or otherwise) for thick n-channel epitaxial wafers. Some researchers have reported success in improving SiC to accommodate higher voltage IGBTs. However, commercial exploitation of this knowledge has not occurred due to a much larger market for moderate voltage transistors. Detailed f ...
SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity -
High Voltage and Speed SiC MOSFETs through Improved Gate Dielectric Interfaces
SBC: MAINSTREAM ENGINEERING CORP Topic: DMEA221D01Development of high voltage gated semiconductor device process that leverages the enhanced power handling capability of SiC, and remediates the undesirable effects (threshold voltage instability, increased interface capacitance) associated with native SiO2 growth from commercially available 4H-SiC and 6H-SiC polytypes. The process improvement and resultant performance enhancements gained will be v ...
SBIR Phase II 2022 Department of DefenseDefense Microelectronics Activity -
20009- Partha
SBC: CFD RESEARCH CORPORATION Topic: 20A001Radiation effects in microelectronics are a significant concern for DoD systems that operate at high altitudes or in outer space. Typical characterization efforts focus on macroscale degradation signatures from electrical measurements at device terminals. However, a comprehensive analysis of radiation-induced physical defects is not possible based solely on terminal measurements. CFD Research and ...
STTR Phase II 2022 Department of DefenseDefense Microelectronics Activity -
Robust DNA Taggant Reader for Electronics Counterfeit Prevention
SBC: NANOHMICS INC Topic: DMEA201001Defense MicroElectronics Activity (DMEA) seeks to develop a robust technique to sample and read DNA taggants applied to surfaces of microelectronics supply chain components that employs machine learning methods to develop trained models capable of detecting counterfeit microelectronic parts with > 95% accuracy. To address the need for rapid (< 5 minute) genetic taggant signature profiling rooted i ...
SBIR Phase II 2022 Department of DefenseDefense Microelectronics Activity -
A TEM-Based Thermal and Electronic Imaging System
SBC: NANOELECTRONIC IMAGING, INC. Topic: DMEA192001The transmission electron microscope (TEM) is the standard high resolution tool for imaging microelectronics. Despite its impressive sensitivity to physical structure (the type, number, and arrangement of atoms), TEM is remarkably inept at detecting electronic and thermal signals, even when equipped with expensive spectroscopic attachments. Electronic and thermal structure determines device functi ...
SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity -
Machine Learning Applied to Counterfeit Detection
SBC: GRAF RESEARCH CORPORATION Topic: DMEA192002The machine learning for counterfeit detection research program continues the successful Phase 1 feasibility study of applying machine learning to detect FPGA counterfeits. In Phase 1, Graf Research demonstrated the feasibility of implementing a machine learning based counterfeit detection platform for a single FPGA device and representing data characteristic of repackaged counterfeit devices. T ...
SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity -
Rapid, Portable, Surface Texture Based Component Classifier (RAPSTEC) System
SBC: CHROMOLOGIC LLC Topic: DMEA192002In order to meet the Defense Microelectronics Activity (DMEA) need to support the ongoing Department of Defense (DOD) challenge to ensure the authenticity and security of microelectronics parts within its supply chain, ChromoLogic LLC (CLL) proposed, developed and demonstrated a Phase I RAPSTEC system. RAPSTEC is based on a machine vision system designed to capture the surface features of a microe ...
SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity