The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.
SBC: TLC Precision Wafer Technology, Inc. Topic: BMDO00014
TLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using I ...SBIR Phase II 2004 Department of DefenseMissile Defense Agency
SBC: SVT ASSOCIATES, INCORPORATED Topic: BMDO02T00
InP-based devices have applications encompassing the entire communication technology including wireless and fiber-optic telecommunications. It is especially suitable for very high frequency (up to 200GHz) operation. Therefore they are increasingly a critical component in all military missions. Their manufacturing costs are high in large part due the high cost of InP substrates, and their much smal ...STTR Phase II 2004 Department of DefenseMissile Defense Agency
SBC: NVE CORP. (FORMERLY NONVOLATILE ELECTRONICS, INC. Topic: BMDO02004
Magneto-Thermal MRAM uses both heat and magnetic field (current)to overcome thermal instabilities of very small memory cells. Self-generated heat in the cell raises the temperature of magnetic material in the cell above the exchange ordering temperature of the magnetic material (either ferromagnetic or anti-ferromagnetic). Magneto-Thermal MRAM is compatible with advances in photolithography down t ...SBIR Phase II 2004 Department of DefenseDefense Threat Reduction Agency