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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Bandgap Engineered Rad-Hard Multi-Function Digital MMW/Photonic Circuits

    SBC: TLC Precision Wafer Technology, Inc.            Topic: BMDO00014

    TLC has developed an innovative multi-component radiation hard InP HEMT based chip approach that will provide monolithic digital,millimter-wave and photnic functions for airborne, spaceborne and other military systems. During phase I we demonstrated lattice engineering, epi growth, design and device fabriction capabilities that resulted in high performance electronic and photonic devices using I ...

    SBIR Phase II 2004 Department of DefenseMissile Defense Agency
  2. High Performance Actuators for Solid Propulsion Control Systems

    SBC: ELECTRIC DRIVETRAIN TECHNOLOGIES LLC            Topic: MDA16010

    The Missile Defense Agency seek solid propellant, propulsion control systems with longer operation times, increased performance, and reduced size, weight, power, and cost.Solid propellant exhaust gases are commonly 2,000-4,000F.Proportionally controlled actuators that are capable of enduring higher temperatures while aiming to maintain performance and/or reduce SWaP-C will improve the robustness o ...

    SBIR Phase II 2018 Department of DefenseMissile Defense Agency
  3. Large Area Si Substrates for InP Based Electronics and Optical Device Manufacturing

    SBC: SVT ASSOCIATES INC            Topic: BMDO02T00

    InP-based devices have applications encompassing the entire communication technology including wireless and fiber-optic telecommunications. It is especially suitable for very high frequency (up to 200GHz) operation. Therefore they are increasingly a critical component in all military missions. Their manufacturing costs are high in large part due the high cost of InP substrates, and their much smal ...

    STTR Phase II 2004 Department of DefenseMissile Defense Agency
  4. Magneto-Thermal MRAM

    SBC: NVE CORP. (FORMERLY NONVOLATILE ELECTRONICS, INC.            Topic: BMDO02004

    Magneto-Thermal MRAM uses both heat and magnetic field (current)to overcome thermal instabilities of very small memory cells. Self-generated heat in the cell raises the temperature of magnetic material in the cell above the exchange ordering temperature of the magnetic material (either ferromagnetic or anti-ferromagnetic). Magneto-Thermal MRAM is compatible with advances in photolithography down t ...

    SBIR Phase II 2004 Department of DefenseDefense Threat Reduction Agency
  5. Radiation Mitigating System-in-Package Electronics

    SBC: TRUSTED SEMICONDUCTOR SOLUTIONS INC            Topic: AF151089

    Trusted Semiconductor Solutions will demonstrate how high-reliability substrate material, leading-edge commercial memories, advanced manufacturing processing, and our radiation circumvention and recovery approach enables high density electronic payloads needed for next generation guided missile and space applications. We will develop a prototype system-in-package (SiP) that utilizes commercial mem ...

    SBIR Phase II 2018 Department of DefenseMissile Defense Agency
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