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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY20 is not expected to be complete until September, 2021.

  1. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
  2. Interceptor Seekers

    SBC: VOXTEL, INC.            Topic: MDA08002

    A 128 x 128-format avalanche photodiode (APD) focal plane array (FPA), including a low-power dual-mode readout integrated circuit (ROIC) and low excess noise, high gain (M>1,200) will be developed for laser radar (LADAR) applications requiring reduced SWAP. The FPA gives LADAR seekers an advanced active tracking sensor capability, providing a sufficiently wide field of regard (FOR) to eliminate th ...

    SBIR Phase II 2010 Department of DefenseMissile Defense Agency
  3. Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

    SBC: Foresite, Inc.            Topic: MDA08T010

    The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to ...

    STTR Phase II 2010 Department of DefenseMissile Defense Agency
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