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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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High Current Vertical Photoconductive Semiconductor Switch (PCSS) and Trigger Subsystem
SBC: Eureka Aerospace Topic: DMEA231005Implementation of multiple parallel current-sharing filaments in high-voltage photoconductive semiconductor switches (PCSS) has been shown to be very effective in scaling the current handling capability of the devices. This approach increases the active current-switching area on the surface of the device to handle higher total current. In this effort, we will develop a vertical geometry PCSS that ...
SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity -
Ultra-Wideband, Low-Voltage, Low-power, Low Phase Noise CMOS Voltage Controlled Oscillator
SBC: TERASPATIAL INC Topic: DMEA231006This proposal is submitted in response to the DoD’s need for a low-power, US-sourced, ultra-wideband VCO designed to work over -55ºC to 125ºC, with high level of programmability and reconfigurability for different applications. This proposal describes a novel design that meet these requirements, building on more than 10 years of prior R&D in this area.
SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity -
Thermo-plastically Formed Resonator Clocks for Ultra High Shock Environments
SBC: Tanner Research, Inc. Topic: DMEA231002One advanced material found to survive high G-forces and also is defect and grain-size free is thermos-plastic formed (TPF) Bulk Metallic Glasses (BMG). Unlike MEMS-based silicon components which often do not survive high-G, high shock environments, Tanner Research and Yale University have successfully demonstrated thermos-plastic formed (TPF) Bulk Metallic Glass (BMG) use as an alternative materi ...
SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity -
Automated Measurement of Passive Devices in Printed Circuit Assemblies
SBC: A.T.E. SOLUTIONS, INC. Topic: DMEA231008Passive components, such as resistors, capacitors and inductors, present a unique complication when reverse engineering is attempted. Automated measurements of device values on populated printed circuit boards - resistance, capacitance and inductance - is complicated by the network effect of neighboring components connected to the component being measured. Some solutions are applicable to s ...
SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity -
Rapid, Portable, Surface Texture Based Component Classifier (RAPSTEC) System
SBC: CHROMOLOGIC LLC Topic: DMEA192002In order to meet the Defense Microelectronics Activity (DMEA) need to support the ongoing Department of Defense (DOD) challenge to ensure the authenticity and security of microelectronics parts within its supply chain, ChromoLogic LLC (CLL) proposes to develop RAPSTEC. RAPSTEC is based on a machine vision system designed to capture the surface features of a microelectronic component and use machin ...
SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity -
A High-Resolution TEM Thermometry System
SBC: NANOELECTRONIC IMAGING, INC. Topic: DMEA192001High-resolution, transmission electron microscope, electron beam induced current, EBIC, STEM EBIC, temperature, thermometry
SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity -
Through-Lens Fiducial Marking System
SBC: Checkpoint Technologies LLC Topic: DMEA172002The objective of this proposal is to demonstrate the feasibility of the innovative development of a tool that can be integrated into an IR microscope that is able to create fiducial marks on the surface of the backside of silicon.The current state-of-art in semiconductor device analysis involves procedures that begin with the identification of areas of interest under an IR microscope and then thos ...
SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity -
High-Resolution X-ray Microscopy Image Acquisition, 3D Reconstruction, and Analysis SoftwareSystem
SBC: Physical Optics Corporation Topic: DMEA152002To address the DMEA need for algorithms and software to accurately analyze data from X-ray microscopy of integrated circuits (ICs), PhysicalOptics Corporation (POC) proposes to develop a new X-ray Microscopy Image Acquisition, 3D Reconstruction, and Analysis Software (XARA)system for rapid identification and mapping of conductors of ICs. It is based on (a) novel swing nanolaminography image acquis ...
SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity -
High-Efficiency Integrated Si APD Quantum Key Receiver
SBC: FREEDOM PHOTONICS LLC Topic: DMEA142001High-efficiency detectors capable of single photon detection are one of the key technologies required for adoption of QKD technology. These detection systems need to be made more robust, to be offered at lower cost, and to move out of the laboratory to provide ubiquitous commercial access. Freedom Photonics will develop a highly integrated and compact single photon avalanche photodetector with ...
SBIR Phase I 2015 Department of DefenseDefense Microelectronics Activity -
Laser Alignment and Infrared Inspection
SBC: Physical Optics Corporation Topic: DMEA172002To address the DMEAs need to perform failure analysis on microelectronic components using infrared microscope systems to locate areas of interest and then navigate accurately to these same locations in a focused ion beam tool, Physical Optics Corporation (POC) proposes to develop a new Laser Alignment and Infrared Inspection (LAIRI) system. It is based upon the integration of a state-of-the-art co ...
SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity