You are here

Award Data

For best search results, use the search terms first and then apply the filters
Reset

The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Compact Passive Millimeter Wave Sensor for GPS-denied Navigation

    SBC: PHASE SENSITIVE INNOVATIONS INC            Topic: AF15AT26

    Under the proposed effort, PSI will leverage a novel pmmW imaging technology developed under a prior Navy program to realize the low size, weight, and power sensors required for UAV implementation. This technology is based on an optical upconverted distributed aperture technology that can make large effective apertures in low SWaP form factors thereby maximizing achievable resolution. This sensor ...

    STTR Phase II 2017 Department of DefenseAir Force
  2. Efficient Arrays for Generating Light Emission (EAGLE)

    SBC: Chip Design Systems Inc.            Topic: AF16AT22

    With today's IRLED devices, >99.4% of input electrical power is converted into parasitic/waste heat. Moreover, as the local temperatures of the pixels increase due to the generated heat, IRLED optical efficiency is further reduced. Overall this severely limits the number and intensity of array pixels that can be simultaneously operated at high apparent temperatures. In Phase 2, we focus on develop ...

    STTR Phase II 2017 Department of DefenseAir Force
  3. Functional Additive Manufacturing for Printable & Networkable Sensors to Detect Energetics and Other Threat Materials

    SBC: Delux Advanced Manufacturing, LLC            Topic: A17AT004

    Chemiresistors are an important class of electronic sensors that detect the presence of analytes/chemicals via a change in the resistance of a sensor element. A typical interdigitated electrode array is deposited onto an insulating substrate with metallic electrodes that have feature sizes in the 5-500 m range. The metal electrodes are typically sputter coated onto the substrate, using lithogra ...

    STTR Phase I 2017 Department of DefenseArmy
  4. Instant k-Space Tomography for Spatial-Spectral Monitoring

    SBC: PHASE SENSITIVE INNOVATIONS INC            Topic: AF17AT013

    The Army is frequently forced to operate in hostile climates. Heavy fog, rain, snow, and dust storms can inhibit the performance of tracking technologies such as mid-wave infrared cameras. In such conditions, Army early warning systems are blinded and put personnel and assets at risk. There is a specific need for a degraded visual environment (DVE) penetrative target tracking solution. Radio fre ...

    STTR Phase I 2017 Department of DefenseAir Force
  5. Novel Multi-scale/Multi-physics Integrated Tool for the Prediction of Manufacturing-Induced Defects in Autoclave Composite Airframe Parts

    SBC: COMPOSITES AUTOMATION LLC            Topic: N15AT003

    A multi-scale/multi-physics software tool will be developed to predict manufacturing-induced defects, specifically void evolution during composites manufacturing, due to materials, parts, tooling and process parameters. Appropriately modeling the manufacturing process to identify potential problem areas will enable process optimization to produce structural components without defects. Specifically ...

    STTR Phase II 2017 Department of DefenseNavy
  6. Wafer-Level Electronic-Photonic Co-Packaging

    SBC: PHASE SENSITIVE INNOVATIONS INC            Topic: AF16AT01

    In this STTR effort we will develop key packaging techniques for wafer-level hybrid electrical-optical co-packaging based on silicon photonic platform. These techniques include packaging LiNbO3 modulator on insulator (LNOI), high-speed modified uni-traveling carrier (MUTC) photodiodes packaging and high-efficiency fiber coupling. Silicon is the desired host material for photonic integrated circuit ...

    STTR Phase I 2017 Department of DefenseAir Force
US Flag An Official Website of the United States Government