Award Data

We propose to lay the groundwork for the implementation of a completely integrated SiC BiCMOS/LDMOS technology for integrated control/power circuit applications reliable for operation up to 300 C. Our workplan to accomplish this goal comprises improving device speed and reliability by device engineering, establishing baseline reliability and qualification tests to support and certify development, ...

The aging supply chain management is the available long term protection against IC counterfeiting. For better protection, there is an urgent need for an advanced counterfeit detection system. The industry has made progress in cataloging the features in counterfeit parts and the physical tools to detect them. However, the methods still largely depend on human skills which are time consuming and oft ...

Semiconductor processing technology continuously advances to package greater capability into smaller footprints, leading to nanometer feature sizes. Increasingly, nanometer scale impurities can cause fatal circuit flaws. Consequently it is important to monitor semiconductor processing solvents for particle impurities in the 20 nm to 10 micron range. Existing liquid particle detectors function wel ...

ASIC and FPGA design and manufacturing companies are globally distributed. As a result, third party IP designs sent to offshore to untrusted fabs for manufacture are vulnerable to security threats such as cloning, over-building and reverse engineering. There is a growing need to enhance the security of the ASIC and FPGA supply chain. The blockchain technology which is primarily used in cryptocurr ...

High brightness x ray sources are large and expensive due to the extreme thermal conditions produced when generating the x rays. Creare proposes to advance the brightness of x ray sources in the 9-11 keV range beyond the current state-of-the-art using an innovative thermal design that builds on Creares experience in high-heat flux thermal management, vacuum systems, and precision machinery. Duri ...

Facile reverse engineering of existing devices by means of 3D reconstruction is an emergent need for advanced semiconductor technologists who seek to understand product failures, to improve device design and manufacturability, and to verify as-built device compliance to specified designs. The latter objective relates particularly to trusted and counterfeit device programs. Today's barriers ...

By attention to lattice parameter matching, thermal expansion coefficient mismatch reduction and composition of conducting epitaxial detemined.