Award Data

Interfaces on existing military chemical/biological protection garments are not designed to fully eliminate macroscopic and microscopic air gaps at folds, fabric surfaces, or hook-and-loop closures, and thus do not provide a hermetic barrier against exposure. Creare proposes to develop a hermetic garment closure system that seals macroscopic and microscopic gaps at interfaces and closures and pro ...

Chemical, biological, or toxin attacks in military and civilian settings are a serious and growing concern. Standard first aid for exposure to some chemical warfare agents and toxins includes the immediate administration of relevant antidotes using an autoinjector. When an attack occurs, pre-filled autoinjectors must be immediately available and thus highly portable, and they must be suitable fo ...

DNA microarray technology, in combination with statistical and predictive modeling tools, could be used to evaluate thousands of genes against distinct gene expression patterns induced by chemical/biological agents to provide early identification and speed therapeutic intervention. The overall objective of this Phase II effort is to leverage existing public domain resources and commercial tools t ...

Effective collective protection fabrics must have a reliable closure system. During our Phase I Work Plan, Sigma-K began developing a Hermetic Textile Closure Hardware (HATCH) system. The HATCH combines both a magnetic and geometric self locking mechanism that will provide a hermetic seal when closed. Our current Phase I successes include developing self closing samples that can provide a hermetic ...

The current methodology for testing the penetration resistance of textile materials to various chemical agents has a number of drawbacks, including significant uncertainties in the resulting data, inefficiency and expense, risk to test personnel, and limited range of test conditions. The objective of the proposed work is to apply unique computer models for textiles with accompanying experimental ...

This research project involves the application, development, and commercial scale up of a process for the deposition of copper and copper barrier materials such as ruthenium, titanium, and other metals. This process could replace copper electroplating currently used to fill deep trenches and thin-film deposition in microelectronic circuit manufacturing. In addition, physical vapor depo ...

THE PLATING AND ELECTRONICS INDUSTRIES ARE REQUIRED BY STATEAND FEDERAL REGULATIONS TO REMOVE TOXIC, HEAVY METALS FROM WASTEWATER STREAMS BEFORE DISCHARGE. THE SEMICONDUCTOR AND AND PRINTED CIRCUIT INDUSTRY ALONE REMOVED OVER 7.2 TONS OF HEAVY METALS FROM WASTEWATER IN 1983. MUCH OF THE RECOVERED METALS ARE DISCARDED AS SLUDGES, BECAUSE TECHNIQUES FOR RECOVERING AND SEPARATING THE METAL IONS ARE U ...

This proposal describes the application, development and commercial scale-up of a process successfully developed under EPA contract number EP-D-04-042 for the deposition of copper and copper barrier materials such as ruthenium, titanium and other metals. This process could replace CU electroplating currently used to fill deep trenches and thin film deposition in microelectronic circuit manufactur ...