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The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. High Voltage Encapsulant Material

    SBC: LaunchBay LLC            Topic: DMEA231003

    Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several diff ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  2. 2nd Phase II Radiation Shielding (SI Technologies)

    SBC: SI2 TECHNOLOGIES, INC            Topic: MDA17012

    SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  3. Photon Correlation Spectroscopy for Particle Counting and Sizing in Bulk Liquid

    SBC: OPTOWARES INC            Topic: DMEA182001

    There is a lack of in-situ, non-contact, non-destructive techniques to detect the presence of particulates contaminating bulk liquid samples in clean room environment during semiconductor processing.  Leveraging our extensive experience building optical sensor systems, we will design and build an innovative handheld particle counter using diffusive wave spectroscopy. Our handheld system can be u ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
  4. Metrology of Thin Films on Sapphire Substrate

    SBC: OPTOWARES INC            Topic: DMEA16B001

    There is a lack of a non-destructive metrology tool to measure the thickness of thin films on sapphire substrates due to the transparency of the substrate. Leveraging our extensive experience building sensor systems combined with MIT Lincoln Laboratory’s expertise in theoretical modeling, we will design and build an innovative thin film measurement tool using Raman spectroscopy. Our metrology sy ...

    STTR Phase II 2019 Department of DefenseDefense Microelectronics Activity
  5. Metrology of thin films on sapphire substrate

    SBC: OPTOWARES INC            Topic: DMEA16B001

    There is a lack of non-destructive metrology tool to measure the thickness of thin films on sapphire substrate due to the transparency of the

    STTR Phase I 2017 Department of DefenseDefense Microelectronics Activity
  6. ZnS Scintillator for High Resolution X-ray Imaging at 9keV

    SBC: CERANOVA CORP            Topic: DMEA15B001

    Novel scintillator materials are needed to address the requirements of fast, high resolution x-ray microscopy, including higher stopping power and light yields. Achieving the required high efficiency and high spatial resolution is challenging and depends strongly on the scintillator characteristics. Knowledge of the details of the trap states can lead to significantly reduced afterglow and fast ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  7. New Sensor for 9 keV HRXM

    SBC: RADIATION MONITORING DEVICES, INC.            Topic: DMEA15B001

    The use of penetrating radiation such as x-rays allows probing materials for their internal structure through direct imaging methods in a non-destructive way. X-rays as more penetrating and with shorter wavelengths than visible light allow imaging internal structures with better resolution. The resolution of details can reach nm sizes. This is realized in High Resolution X-ray Microscopy (HRXM). ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  8. Magnetoelectric Transducer Array for Long Range Near-field Magnetic Communication

    SBC: FERRO SOLUTIONS, INC.            Topic: DMEA092003

    In this Small Business Innovation Research Phase I project, Amsen Technologies is teamed with the Center for Advanced Materials (CAM) of University of Houston to develop a process to fabricate BST thin film capacitors with reduced series resistance through an innovative interface optimization strategy. The overall objective of the present innovation is to grow epitaxial or highly oriented BST th ...

    SBIR Phase I 2009 Department of DefenseDefense Microelectronics Activity
  9. High-Throughput Experimentation Physical Vapor Deposition (PVD) Chamber for Accelerated Microelectronics Materials Research and Development

    SBC: PVD Products, Inc.            Topic: DMEA07001

    Techniques for producing combinatorial materials are highly valued for their ability to produce compositional arrays that can be rapidly evaluated. A significant aspect that is still lacking in combinatorial film deposition is the ability to efficiently deposit multiple material conditions in specified isolated areas on a large silicon wafer while varying local composition and deposition conditio ...

    SBIR Phase I 2008 Department of DefenseDefense Microelectronics Activity
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