Award Data

In the field of seismic event identification, three spatial dimensions and one time dimension are almost always coupled together. This may create confusion in data perception and interpretation. A novel multi-D display device wchih can improve data visualization is needed. The object of this project is to develop a Volumetric Image Display (VID) capable of displaying multi-D volumetric images in a ...

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The initial step to producing a series of interactive HyperCard packages for laboratory instructionwill involve developing a template program based on the Physiology of striated muscle. The flexibilityinherent within the software programs will permit students to learn at their own level. QuickTime videosequences will be developed to display the experiment on the computer screen together with dataa ...

Efficient blue and UV lasers are key to high density optical storage, novel communication systems, industrial and medical lasers, and specialized spectroscopic tools. By virtue of their direct bandgap (ranging from 2.09eV-InN to 3.44eV-GaN to 6.2eV-AlN) and lattice-matched heterostructure system, the III-V nitride-based semiconductors have the greatest potential to enable devices that will meet th ...

We propose a novel growth technique to produce low defect density GaN substrates - misfit dislocations will be greatly reduced and the defects due to thermal expansion mismatches will be eliminated. In Phase I the feasibility of the technology will be demonstrated. In Phase II, the process will be scalled and the substrates will be used to fabricate bright blue LEDs in collaboration with Hewlett-P ...

The ability to control large amounts of power (1-150kW) is necessary in applications ranging from aerospace to consumer electronics to industrial power systems and transportation. In order for silicon and gallium arsenide devices to meets such high power densities, tens of devices must be combined to meet the voltage and current requirements. Power combining networks, extra heatsinking and sophist ...

Future aeropropulsion systems require high temperature electronics and integrated sensors to meet desired performance levels. The wide bandgap of silicon carbide (SiC) makes it ideally suited for high temperature operation. To date, virtually all SiC-based devices have been fabricated using 6H-SiC. Device performance would significantly increase if 3C-SiC, the cubic form, were available. 3C-SiC ha ...