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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Digital-Output Capacitive Accelerometers for High-G Applications

    SBC: INTERDISCIPLINARY CONSULTING CORP            Topic: DMEA231001

    In response to the 2023 DMEA SBIR Phase I solicitation topic DMEA231-001 titled High-G Accelerometers, the Interdisciplinary Consulting Corporation (IC2) proposes to develop a robust, real-time, tri-axis accelerometer using microelectromechanical systems (MEMS) technology that can provide accurate measurements in high-G environments and survive up to 60 kG. MEMS accelerometers have played a cruci ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  2. Novel Manufacturing Process for Advanced Low-Cost High-Power Epitaxy Silicon Switches

    SBC: RADIATION DETECTION TECHNOLOGIES, INC.            Topic: DMEA231D01

    Currently, the US has limited production facilities for opening switches, e.g., DSRDs, which are manufactured with very outdated manufacturing methods and technology, e.g., based on deep diffusion of dopants into a thinned silicon wafer. The goal of this effort is to develop scaled manufacturing processes, manufacture batch quantities, and enable high-volume manufacturing of semiconductor opening ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  3. High Voltage Encapsulant Material

    SBC: LaunchBay LLC            Topic: DMEA231003

    Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several diff ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  4. 2nd Phase II Radiation Shielding (SI Technologies)

    SBC: SI2 TECHNOLOGIES, INC            Topic: MDA17012

    SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  5. Supply Chain Development of Thick SiC Epi-Wafers and 20 kV Class Transistors

    SBC: MAINSTREAM ENGINEERING CORP            Topic: DMEA231D02

    SiC IGBT devices remain restricted from achieving higher voltage operation due the lack of a supply chain (onshore or otherwise) for thick n-channel epitaxial wafers. Some researchers have reported success in improving SiC to accommodate higher voltage IGBTs. However, commercial exploitation of this knowledge has not occurred due to a much larger market for moderate voltage transistors. Detailed f ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  6. High-G Clock Source

    SBC: Esc Aerospace US, Inc            Topic: DMEA231002

    At the center of most operational systems is TIME. Time enables us to communicate, to synchronize, to control, and to position. An accurate, reliable, low size, weight and power timing source is critical to our esc Aerospace PNT solution NavXTM for accurate and reliable PNT in total GPS denial. However, it is equally critical in a vast number of military and commercial applications. Historica ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  7. High Voltage and Speed SiC MOSFETs through Improved Gate Dielectric Interfaces

    SBC: MAINSTREAM ENGINEERING CORP            Topic: DMEA221D01

    Development of high voltage gated semiconductor device process that leverages the enhanced power handling capability of SiC, and remediates the undesirable effects (threshold voltage instability, increased interface capacitance) associated with native SiO2 growth from commercially available 4H-SiC and 6H-SiC polytypes. The process improvement and resultant performance enhancements gained will be v ...

    SBIR Phase II 2022 Department of DefenseDefense Microelectronics Activity
  8. Recycling Fast-Response Atom Interferometer for Navigation (ReFRAIN)

    SBC: PHYSICAL SCIENCES INC.            Topic: OSD221006

    Physical Sciences Inc. (PSI) will develop a Recycling Fast-Response Atom Interferometer for Navigation (ReFRAIN) as an atom interferometer (AI) accelerometer specially designed to improve inertial navigation systems (INS) on moving platforms.  The ReFRAIN provides sensitivity, dynamic range, bandwidth, and bias stability that matches or exceeds state of the art mechanical accelerometers.  PSI in ...

    SBIR Phase I 2022 Department of DefenseOffice of the Secretary of Defense
  9. Photon Correlation Spectroscopy for Particle Counting and Sizing in Bulk Liquid

    SBC: OPTOWARES INC            Topic: DMEA182001

    There is a lack of in-situ, non-contact, non-destructive techniques to detect the presence of particulates contaminating bulk liquid samples in clean room environment during semiconductor processing.  Leveraging our extensive experience building optical sensor systems, we will design and build an innovative handheld particle counter using diffusive wave spectroscopy. Our handheld system can be u ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
  10. Electro-optical Seeker

    SBC: CERANOVA CORP            Topic: OSD181002

    Execution of long-range weapons capabilities reduces risk and affords greater warfighter protection. Core enabling technologies for hypersonic projectiles include high-strength lightweight materials, precision avionics, and novel designs. System demands include the ability to withstand both high accelerations (up to 50,000 Gs) and aerothermal shock. Detailed structural engineering and shock modeli ...

    SBIR Phase I 2019 Department of DefenseOffice of the Secretary of Defense
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