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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Ultra-Wideband Voltage Controlled Oscillator with Multi-Mode Operations

    SBC: ALPHACORE INC            Topic: DMEA231006

    The U.S. Dept of Defense is seeking a low power (< 30mA @ 3V), US-sourced, ultra-wideband voltage-controlled oscillator (VCO). Fuzing applications that employ Height of Burst (HOB) sensors utilize specialized chipsets that set the operating range and output power for these systems, and different applications require specific parameters given operational environments, input power, form factor, etc. ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  2. High Voltage Encapsulant Material

    SBC: LaunchBay LLC            Topic: DMEA231003

    Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several diff ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  3. 2nd Phase II Radiation Shielding (SI Technologies)

    SBC: SI2 TECHNOLOGIES, INC            Topic: MDA17012

    SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  4. Recycling Fast-Response Atom Interferometer for Navigation (ReFRAIN)

    SBC: PHYSICAL SCIENCES INC.            Topic: OSD221006

    Physical Sciences Inc. (PSI) will develop a Recycling Fast-Response Atom Interferometer for Navigation (ReFRAIN) as an atom interferometer (AI) accelerometer specially designed to improve inertial navigation systems (INS) on moving platforms.  The ReFRAIN provides sensitivity, dynamic range, bandwidth, and bias stability that matches or exceeds state of the art mechanical accelerometers.  PSI in ...

    SBIR Phase I 2022 Department of DefenseOffice of the Secretary of Defense
  5. Highly-Integrated SiC BiCMOS/Power Device Technology: Design, Modeling, and Reliability Metrics

    SBC: COOLCAD ELECTRONICS, LLC            Topic: DMEA211001

    We propose to lay the groundwork for the implementation of a completely integrated SiC BiCMOS/LDMOS technology for integrated control/power circuit applications reliable for operation up to 300 C. Our workplan to accomplish this goal comprises improving device speed and reliability by device engineering, establishing baseline reliability and qualification tests to support and certify development, ...

    SBIR Phase I 2021 Department of DefenseDefense Microelectronics Activity
  6. DATUM: Determining Authenticity and Trustworthiness of Microelectronics Parts

    SBC: Intelligent Automation, Inc.            Topic: DMEA192002

    The aging supply chain management is the available long term protection against IC counterfeiting. For better protection, there is an urgent need for an advanced counterfeit detection system. The industry has made progress in cataloging the features in counterfeit parts and the physical tools to detect them. However, the methods still largely depend on human skills which are time consuming and oft ...

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  7. Backside Inspection Frontside Electrical Stimulation System

    SBC: INFRARED LABORATORIES INC            Topic: DMEA192D01

    Infrared Laboratories proposes a direct to phase II program for delivering an electrical stimulation system to be used with DMEA’s existing IREM backside inspection system. Our delivered system will operate using proven technology that we will develop to work with DMEA’s existing tool. The system will be capable of using probe cards as well as individual micro manipulated probe tips to stimula ...

    SBIR Phase II 2020 Department of DefenseDefense Microelectronics Activity
  8. Photon Correlation Spectroscopy for Particle Counting and Sizing in Bulk Liquid

    SBC: OPTOWARES INC            Topic: DMEA182001

    There is a lack of in-situ, non-contact, non-destructive techniques to detect the presence of particulates contaminating bulk liquid samples in clean room environment during semiconductor processing.  Leveraging our extensive experience building optical sensor systems, we will design and build an innovative handheld particle counter using diffusive wave spectroscopy. Our handheld system can be u ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
  9. FEOL &amp; BEOL PARTITIONING

    SBC: ALPHACORE INC            Topic: DMEA182002

    Alphacore proposes Dr. Yago Gonzalez-Velo as the principal investigator (PI) for this SBIR program. Dr. Gonzalez-Velo has experience ranging from radiation effects, characterization to implementation of novel technologies in the BEOL of CMOS circuits. Dr Gonzalez Velo has gained experience in BEOL layer design, as well as photolithography mask design, and MEMS manufacturing experience through dif ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
  10. BlockChain Enhancement for Trusted FPGAs &amp; ASICs

    SBC: Intelligent Automation, Inc.            Topic: DMEA182003

    ASIC and FPGA design and manufacturing companies are globally distributed. As a result, third party IP designs sent to offshore to untrusted fabs for manufacture are vulnerable to security threats such as cloning, over-building and reverse engineering. There is a growing need to enhance the security of the ASIC and FPGA supply chain. The blockchain technology which is primarily used in cryptocurr ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
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